Symposium Dates: Thursday & Friday, 23-24 February 2023
Download chapters from the Heterogeneous Integration Roadmap (no cost).
Videos from last year’s 2022 Symposium to view.
| Time (PST) | Speaker | Title |
| WEDNESDAY, 22 February 2023 | ||
| 1:00 – 2:15 PM |  Bapi Vinnakota, OCP/ODSA
|
Profiling the Open Chiplets Economy |
| 2:30 PM | Reports on NIST Roadmaps: Slides: SEMI-UCLA Project | 5G/6G MAESTRO Roadmap | SRC MAPT Roadmap |
Gity Samadi, The SEMI-UCLA Project Urmi Ray, 5G/6G MAESTRO Roadmap Victor Zhirnov, The SRC MAPT Roadmap |
| THURSDAY, 23 February 2023 | ||
| 9:00 AM | Welcome and Thanks: “The Heterogeneous Integration Roadmap: Paving the Way for Electronics Resurgence” Slides:  Video:  (19:37)
|
 Dr. William (Bill) Chen, ASE, and co-chair of the IEEE/ASME/SEMI Heterogeneous Integration Roadmap (more)
|
| 9:30 AM | “Update on the CHIPS Research and Development Programs” Slides: Video: (23:35 + Q&A)
|
 Dr Robert Rudnitsky, NIST Advanced Manufacturing Associate Director (more) |
| 10:05 AM | “Heterogeneous Integration Development – Interdisciplinary Innovations” Slides: Video: (26:58 + Q&A)
|
 Dr. Xin Wu, Corporate Vice President, Advanced Micro Devices (more) |
| 10:50 AM | “A Roadmap for Heterogeneous Integration for the Next Decade and Beyond – An Academic Perspective” Slides: Video: (26:50 + Q&A)
|
 Prof. Madhavan Swaminathan, Director, Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES); Head, EE Department, Pennsylvania State University (more) |
| 11:25 AM | “A Framework for the Organization and Execution of the CHIPS Act-related National Advanced Packaging Manufacturing Program (NAPMP)” Slides: Video: (30:02 + Q&A)
|
 Dr Scott Sikorski, Technology Business Development Executive, IBM Corp. (more) |
| 1:00 PM | ~10-minute summaries: SLIDES: Automotive; | SiP and Module; | MEMS and Sensors Integration; | Single Chip and Multi Chip Integration; | Integrated Power Electronics; | and Supply Chain Video: (1:11:53)
|
Group 1 Working Group Presentations |
| 2:40 PM | ~10-minute summaries: SLIDES: Medical, Health and Wearables; | IoT; | Mobile; | Reliability; | Emerging Research Devices Video: (1:03:20 + Q&A)
|
Group 2 Working Group Presentations |
| 4:00 PM | White Paper: “Additively Manufactured Electronics (AME) for Heterogeneous Integration” Slides: Video: (22:21 + Q&A)
|
 Kris Erickson, Meta (more) |
| FRIDAY, February 24, 2023 | ||
| 9:15 AM | “Basic Research in Microelectronics” Slides: Video: (20:12 + Q&A)
|
 Dr. Bindu Nair, Director of Basic Research, US Department of Defense (more) |
| 10:00 AM | “AI for Chip Technology and Heterogeneous Integration”. Artificial Intelligence (AI) Slides:
|
 Dr. Wei Chung Lo, Deputy General Director, Electronic and Optoelectronic System Research Laboratories (EOSL), Industrial Technology Research Institute (ITRI) (more) |
| 10:45 AM | “Heterogeneous Integration Platform for Next Generation Computing (‘Beyond Moore’)” Slides: Video: (24:08 + Q&A)
|
 Dr Moonsoo Kang, Executive Vice President, Advanced Packaging Business, Device Solution Division, Samsung Electronics (more) |
| 11:20 AM | “High-Bandwidth and Low-Latency Standardized Interconnect for an Open Chiplet Ecosystem” Slides: Video: (38:12 + Q&A)
|
 Dr. Debendra Das Sharma, Senior Fellow, Intel Corp. (more) |
| 12:00 PM | box lunch | |
| 1:00 PM | ~10-minute summaries: SLIDES: High Performance Computing & Data Centers; | 2D-3D Interconnects; | Thermal Management; | Integrated Photonics; | Test; | and Co-Design (1:08:33 + Q&A)
|
Group 3 Working Group Presentations |
| 2:40 PM | ~10-minute summaries: SLIDES: 5G, RF and Analog Mixed Signal; | Simulation; | Aerospace & Defense; | WLP (Fan-in & Fan Out); | Materials & Emerging Research Materials; | and Cyber Security (1:49:29)
|
Group 4 Working Group Presentations
|
| 4:10 PM | White Paper: “Packaging Challenges in Quantum Computing” Slides: Video: (23:46 + Q&A)
|
 Dr. Luu Nguyen, PsiQuantum, IEEE Quantum Initiative Co-Chair, IEEE Future Directions Committee (more) |
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