Silicon Valley Area Chapter

(SCV, SF, OEB)

Some of our past speakers

John Lau
John Lau
Raj Pendse
Raj Pendse
Annette Teng
Annette Teng
Bill Chen
Bill Chen
Leslie Berlin
Leslie Berlin
Mudasir Ahmad
Mudasir Ahmad
Dongkai Shangguan
Dongkai Shangguan
Jan Vardaman
Jan Vardaman
Paul Wesling
Paul Wesling
Xining Zang
Xining Zang
Dr. Ravi Mahajan
Dr. Ravi Mahajan
Dan Tracy
Dan Tracy

Past Meetings and Webinars
To sort by year, use MENU drop-down, above

New Routes and Paradigms in Device Engineering for Nanoelectronics and Nanosystems -- increased complexity, power reduction, variability, 3D integration, energy efficiency, application areas ...
Scheduled
(on the Internet)
Quantum Fiber-Optic Interconnect Technology for Quantum Networks (B. Lee) -- decoherence, cabled infrastructure, quantum-grade, ultra-low loss, system-on-chip ...
Scheduled
(on the Internet)
Advanced Packaging for Silicon Photonics Based Modules and Applications (Bernabé) -- packaging techniques, mass manufacturing, reliability, complexity, scalability, cost ...
Scheduled
(on the Internet)
Adding Stretchability to Flexible Hybrid Electronics by using Metal Gel Interconnects (Taylor Neumann) -- wearables, health monitoring, pliable, comfortable, performance, curvature, motion ...
Scheduled
(on the Internet)
Integration of an Optoelectronic, Flexible Neural Stimulator for Implantable Retinal Prosthesis (Yu-Hsin Liu) -- replace photoreceptors, neural stimulating array, flex substrate, silicon dielets, testing results ...
Scheduled
(on the Internet)
Ultrafast Time Domain Cryogenic CMOS Device Characterization Platform for Quantum Computing Applications (Pragya Shrestha) -- cryo-CMOS, electronic functionality, device technology, low-temp models, low-power, measurements ...
Scheduled
(on the Internet)
Sustainable Electronics - From Dumped e-Waste to a Circular Economy: What is Needed? (Mervi Kröckel) -- legislation, EU targets, recycling steps, applied ecodesign, carbon neutrality, case studies ...
Scheduled
(on the Internet)
An Overview of Chiplet Technology for the AMD EPYC and Ryzen Processor Families (Gabe Loh) -- device scaling, costs, dis-integrated chiplets, motivations, technical solutions ...
Scheduled
(on the Internet)
Package Technology, Design, and Methodology Challenges and Solutions for High Bandwidth Electronic Systems (Kemal Aygun) -- interchip, IO bandwidth, fan-out, 2.5D packaging, design, simulation, analysis, validation ...
Scheduled
(on the Internet)
Hardware Reliability Qualification of Robo-Taxi: Environmental Stress and Failure Modes for Autonomous Vehicle Modules/Components (Fen Chen) -- self-driving profiles, stresses, approaches, analysis, low-sample testing, failure examples ...
Scheduled
(on the Internet)
Electromigration Failure of Solder Interconnects under Non-DC Conditions (CU Kim) -- reliability concern, few studies, scaling issue, insights, testing runs, estimates ...
Scheduled
(on the Internet)
Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly using Conventional Solder Alloys (Rudy Ghosh) -- anisotropic adhesives, alloys, fluxes, wearables, fabrics, results ...
Scheduled
(on the Internet)
Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones (Jeroen Duis) -- photonics motherboard, dissimilar components, hybrid integration, thermal management ...
Scheduled
(on the Internet)
Bonding Technology for the Next Generation Integration Schemes (Jurgen Burggraf) -- die shrink, yield, heterogeneous chips, interconnect challenges, wafer bonding ...
Scheduled
(on the Internet)
3D Packaging for Superconducting Qubits (RN Das) -- microbump-based assembly, superconducting indium bumps, three-tier stacks, alignment accuracy, co-planarity ...
Scheduled
(on the Internet)
Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications (Zia Karim) -- faster cure, lower temperatures, vacuum, thermal stability, properties ...
Scheduled
(on the Internet)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages (Ephraim Suhir) -- vulnerable structural element, practical questions, predictions, failure probability, accelerated test choices ...
Scheduled
(on the Internet)
Packaging and Interconnect Technologies for Cryogenic and Quantum Systems (Michael Hamilton) -- thin-film, multi-conductor, flexible, superconducting cables, low insertion loss ...
Scheduled
(on the Internet)
Additively-Printed Multilayer Flexible Substrates with Z-axis Interconnects (Pradeep Lall) -- aerosol-jet, inkjet, direct-write, screen print, multi-layer, process factors, performance ...
Scheduled
(on the Internet)
Q&A and Discussion Sessions: Heterogeneous Integration Roadmap Symposium Webcasts -- detailed questions and responses regarding the HI Roadmap, symposium videos, opportunity for feedback ...
Scheduled
(on the Internet)
Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance (Gamal Ahmed) -- mechanical integrity, thermal, packaging, materials behavior, costs ...
Scheduled
(on the Internet)
Heterogeneous Integration of Surface Ion Trap, Silicon Photonics and 3D-TSV for Quantum Computing (CS Tan) -- CMOS technology, optical addressing, parasitics, glass substrate, ground plane, improved performance ...
Scheduled
(on the Internet)
Working Group Meetings: 2021 IEEE Heterogeneous Integration Roadmap
from to
Scheduled
(on the Internet)
Fourth Annual Symposium on Heterogeneous Integration -- future packaging for mobile, HPC, automotive, 5G, health, Chiplets, work on 2021 Roadmap ...
Scheduled
(on the Internet)
Design and Analysis of Chiplet Interfaces for Heterogeneous Systems (Wendem Beyene) -- mixed technologies/nodes, parallel interconnects, power domains, supply noise, timing jitter ...
Scheduled
(on the Internet)
High Performance and Reliable Aerosol Jet Printed 3D Interconnects for Bare Die and Components (Bryan Germann) -- flex, wearable, power, signal, bandwidth, performance, implementation, production, examples ...
Scheduled
(on the Internet)
Flexible Hybrid Electronics 2.0 (Subu Iyer) -- FHE, medical, wellness, scaling, advanced packaging technology trends ...
Scheduled
(on the Internet)
Flat-panel Display Systems with Mass-transferred MicroLEDs and MicroICs (Chris Bower) -- vivid, bright, fast, power-efficient, mass transfer technologies, transfer-printing ...
Scheduled
(on the Internet)
Heterogeneous Integration for Power Electronics -- (Pat McCluskey) conversion, distribution, wide-bandgap, reduced-size, power efficiency, thermal ...,
Scheduled
(on the Internet)
Virtual Symposium on Reliability for Electronics and Photonics Packaging -- Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh) ...
from to
Scheduled
(on the Internet)
The Decade of Materials: Novel Materials for the Connected Digital World (Waguih Ishak) -- materials for electronic, RF, photonic applications for 5G, displays, life sciences ...
Scheduled
(on the Internet)
Ribbon Alumina Laminate for PCBs and Substrates (Tim Orsley) -- attributes, homogeneous, signal skew, loss tangent, stresses, drilling, process flow ...
Scheduled
(on the Internet)
Heterogeneous Integration for the Aerospace and Defense Sectors (Jeff Demmin) -- specific challenges, extreme performance, security, low volumes, roadmap ...
Scheduled
(on the Internet)
Design and Materials Challenges for Cost-effective High-performance LEDs (TY Hin) -- solid state lighting, design, materials, processes, challenges, innovative approaches ...
Scheduled
(on the Internet)
Packaging of Electronics for Medical, Health and Wearables Applications -- (Mark Poliks) heterogeneous integration, advance packaging, new materials, assembly technologies, forecasts ...
Scheduled
Design for Reliability and Accelerated Testing in Electronics and Photonics Packaging Engineering -- (Ephraim Suhir) improved reliability, critical applications, product lifetime, DfR, HALT ...
Scheduled
Integrated Photonics for Heterogeneous Integration -- (Bill Bottoms) design, analysis, current capabilities, challenges ...
Scheduled
On the Internet
Co-Design for Heterogeneous Integration -- (José Schutt-Ainé) electrical, thermal, mechanical, chip-package-board, design flow, new tools ...
Scheduled
Modeling and Simulation for Heterogeneous Integration -- (Chris Bailey) enabling technologies, tools, chip-package-board-system domains, challenges ...
Scheduled
Thermal Management Challenges and Opportunities for Heterogeneous Packages -- (Madhu Iyengar, Mehdi Asheghi) cooling requirements, advanced concepts, thermal challenges, active research areas, HI Roadmap ...
Scheduled
Heterogeneous Integration Roadmap: Interconnects for 2D and 3D Architectures -- (Ravi Mahajan) definitions, evolution, key metrics, bandwidth, power delivery, signaling ...
Scheduled
On the Internet
Heterogeneous Integration Roadmap: Driving Force and Enabling Technology for Systems of the Future -- intro to HIR, structure, highlights, examples from chapters, how to download and use ...
Scheduled
(On the Internet)
Recent Advances and Outlook for Heterogeneous Integration -- integrating dissimilar chips, 2.5 and 3D, various substrates, new processes, time-to-market, cost ...
Scheduled
SEMI World Hdqtrs, Milpitas
The Rise of Chiplets: The ODSA Project -- (Bapi Vinnakota) end of Moore's Law, rise of chiplets, ODSA D2D Interface, abstraction layer, reuse ...
Scheduled
SEMI World Hdqtrs, Milpitas
Chiplets on the Rise: DARPA's CHIPS Program (David Kehlet) -- early days, DARPA, standardization, plug-and-play, open-source, new ecosystem ...
Scheduled
SEMI World Hdqtrs, Milpitas
Virtuous Cycle of AI: System-level Challenges -- (Pradeep Dubey) AI transformation, data-intensive, impacts, performance challenges, application opportunities ...
Scheduled
SEMI World Hdqtrs, Milpitas
Heterogeneous Integration Roadmap: 3rd Annual Meeting -- future of mobile, HPC, automotive, 5G, health, Chiplets, work on 2020 Roadmap ...
from to
Scheduled
Samsung Auditorium, San Jose
Trends and Opportunities in Silicon Photonics Packaging for Networking Applications -- SiPh packaging, large-scale data centers, interconnects, long-haul networking, Roadmap, integration ...
Scheduled
(SEMI World Hdqtrs, Milpitas)
IoT and PoE: An Overview, Applications and Future Directions -- sensors, hardware, data centers, App connections, new services, increased power, heat density ...
Scheduled
SEMI World Hdqtrs, Milpitas
System in Package (SiP) for Miniaturized Electronics Modules: An Update -- miniaturized modules, technology landscape, requirements, solutions, flexible electronics ...
Scheduled
SEMI World Hdqtrs, Milpitas