Silicon Valley Area Chapter

(SCV, SF, OEB)

Some of our past speakers

John Lau
John Lau
Raj Pendse
Raj Pendse
Annette Teng
Annette Teng
Bill Chen
Bill Chen
Leslie Berlin
Leslie Berlin
Mudasir Ahmad
Mudasir Ahmad
Dongkai Shangguan
Dongkai Shangguan
Jan Vardaman
Jan Vardaman
Paul Wesling
Paul Wesling
Xining Zang
Xining Zang
Dr. Ravi Mahajan
Dr. Ravi Mahajan
Dan Tracy
Dan Tracy

Past Meetings and Webinars
To sort by year, use MENU drop-down, above

Counterfeit and Fraudulent Parts and Materials: Is it Getting Better or Worse? (Das) -- incidences, impacts, supply chains, shortages, safety, security, current statistics ...
Scheduled
(on the Internet)
Advanced Packaging in Hyperscale Data Center Applications (Xue) -- silicon photonics, SiPho, hyperscale data center, roadmap, building blocks, increasing performance, reduced power per Gbps, reliability, eco-system collaboration ...
Scheduled
(on the Internet)
Data Centers at Meta: Heterogeneous Integration Driven by AI/ML and Network Applications (Ravi Agarwal) -- architecture, specialized use, open ecosystem, chiplets, packaging issues ...
Scheduled
(on the Internet)
The Future of Hardware Technologies for Computing -- nanosystems, leap in integration, chip architectures, 3D integration, Illusion scaleup, co-design, AI training ...
Scheduled
(on the Internet)
Semiconductor Packaging: The Future is Now (Swaminathan) -- emerging applications, on-shoring, US univ programs in semiconductor packaging, curriculum development, workforce ...
Scheduled
(on the Internet)
Recent Advances and Trends in Advanced Packaging (Lau) -- HI, interconnect density, electrical performance, bonding, 2.5D, 3D, chiplets, silicon bridges, advances ...
Scheduled
(on the Internet)
To Chiplet or Not To Chiplet: Heterogeneous Integration and Chiplets (Ahmad) -- HI, large die sizes, cost of miniaturization, balance, disaggregating, splitting the die, when chiplets make sense ...
Scheduled
(on the Internet)
The HAXPES-Lab: How It Works and What It Can Do for the Electronics Industry -- probing materials, top 30 nm, compact system, liquid Ga metaljet, 10keV, examples ...
Scheduled
(on the Internet)
Fifth Annual Symposium on Heterogeneous Integration -- Purpose and Future Vision for Heterogeneous Integration from Global Perspectives, 3 days, 17 on-demand videos ...
Scheduled
(on the Internet)
On-Shoring the Next Generation of Advanced Packaging (Woychik) -- HI, FOWLP, cu-to-cu bonding, 2.5D & 3D, chiplets, domestic sourcing, investments ...
Scheduled
(on the Internet)
Growth in Semiconductor Packaging and Assembly: Are We in Another “Roaring 20s”? (Vardaman) -- investment, continued expansion, drivers, shortages, application areas ...
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(on the Internet)
Chiplet-in-Wafer Technology for the Development of III-V RF ICs (F. Herrault) -- 5G, radar, compound semiconductors, co-integration, packaging solutions, in passive wafer interconnects ...
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(on the Internet)
New Routes and Paradigms in Device Engineering for Nanoelectronics and Nanosystems -- increased complexity, power reduction, variability, 3D integration, energy efficiency, application areas ...
Scheduled
(on the Internet)
Quantum Fiber-Optic Interconnect Technology for Quantum Networks (B. Lee) -- decoherence, cabled infrastructure, quantum-grade, ultra-low loss, system-on-chip ...
Scheduled
(on the Internet)
Advanced Packaging for Silicon Photonics Based Modules and Applications (Bernabé) -- packaging techniques, mass manufacturing, reliability, complexity, scalability, cost ...
Scheduled
(on the Internet)
Adding Stretchability to Flexible Hybrid Electronics by using Metal Gel Interconnects (Taylor Neumann) -- wearables, health monitoring, pliable, comfortable, performance, curvature, motion ...
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(on the Internet)
Integration of an Optoelectronic, Flexible Neural Stimulator for Implantable Retinal Prosthesis (Yu-Hsin Liu) -- replace photoreceptors, neural stimulating array, flex substrate, silicon dielets, testing results ...
Scheduled
(on the Internet)
Ultrafast Time Domain Cryogenic CMOS Device Characterization Platform for Quantum Computing Applications (Pragya Shrestha) -- cryo-CMOS, electronic functionality, device technology, low-temp models, low-power, measurements ...
Scheduled
(on the Internet)
Sustainable Electronics - From Dumped e-Waste to a Circular Economy: What is Needed? (Mervi Kröckel) -- legislation, EU targets, recycling steps, applied ecodesign, carbon neutrality, case studies ...
Scheduled
(on the Internet)
An Overview of Chiplet Technology for the AMD EPYC and Ryzen Processor Families (Gabe Loh) -- device scaling, costs, dis-integrated chiplets, motivations, technical solutions ...
Scheduled
(on the Internet)
Package Technology, Design, and Methodology Challenges and Solutions for High Bandwidth Electronic Systems (Kemal Aygun) -- interchip, IO bandwidth, fan-out, 2.5D packaging, design, simulation, analysis, validation ...
Scheduled
(on the Internet)
Hardware Reliability Qualification of Robo-Taxi: Environmental Stress and Failure Modes for Autonomous Vehicle Modules/Components (Fen Chen) -- self-driving profiles, stresses, approaches, analysis, low-sample testing, failure examples ...
Scheduled
(on the Internet)
Electromigration Failure of Solder Interconnects under Non-DC Conditions (CU Kim) -- reliability concern, few studies, scaling issue, insights, testing runs, estimates ...
Scheduled
(on the Internet)
Use of Flash Lamps to Achieve Non-equilibrium Soldering and Assembly using Conventional Solder Alloys (Rudy Ghosh) -- anisotropic adhesives, alloys, fluxes, wearables, fabrics, results ...
Scheduled
(on the Internet)
Scalable Highly-Integrated Photonics Packaging for the 5G World: From Datacenters to Drones (Jeroen Duis) -- photonics motherboard, dissimilar components, hybrid integration, thermal management ...
Scheduled
(on the Internet)
Bonding Technology for the Next Generation Integration Schemes (Jurgen Burggraf) -- die shrink, yield, heterogeneous chips, interconnect challenges, wafer bonding ...
Scheduled
(on the Internet)
3D Packaging for Superconducting Qubits (RN Das) -- microbump-based assembly, superconducting indium bumps, three-tier stacks, alignment accuracy, co-planarity ...
Scheduled
(on the Internet)
Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications (Zia Karim) -- faster cure, lower temperatures, vacuum, thermal stability, properties ...
Scheduled
(on the Internet)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages (Ephraim Suhir) -- vulnerable structural element, practical questions, predictions, failure probability, accelerated test choices ...
Scheduled
(on the Internet)
Packaging and Interconnect Technologies for Cryogenic and Quantum Systems (Michael Hamilton) -- thin-film, multi-conductor, flexible, superconducting cables, low insertion loss ...
Scheduled
(on the Internet)
Additively-Printed Multilayer Flexible Substrates with Z-axis Interconnects (Pradeep Lall) -- aerosol-jet, inkjet, direct-write, screen print, multi-layer, process factors, performance ...
Scheduled
(on the Internet)
Q&A and Discussion Sessions: Heterogeneous Integration Roadmap Symposium Webcasts -- detailed questions and responses regarding the HI Roadmap, symposium videos, opportunity for feedback ...
Scheduled
(on the Internet)
Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance (Gamal Ahmed) -- mechanical integrity, thermal, packaging, materials behavior, costs ...
Scheduled
(on the Internet)
Heterogeneous Integration of Surface Ion Trap, Silicon Photonics and 3D-TSV for Quantum Computing (CS Tan) -- CMOS technology, optical addressing, parasitics, glass substrate, ground plane, improved performance ...
Scheduled
(on the Internet)
Working Group Meetings: 2021 IEEE Heterogeneous Integration Roadmap
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(on the Internet)
Fourth Annual Symposium on Heterogeneous Integration -- future packaging for mobile, HPC, automotive, 5G, health, Chiplets, work on 2021 Roadmap ...
Scheduled
(on the Internet)
Design and Analysis of Chiplet Interfaces for Heterogeneous Systems (Wendem Beyene) -- mixed technologies/nodes, parallel interconnects, power domains, supply noise, timing jitter ...
Scheduled
(on the Internet)
High Performance and Reliable Aerosol Jet Printed 3D Interconnects for Bare Die and Components (Bryan Germann) -- flex, wearable, power, signal, bandwidth, performance, implementation, production, examples ...
Scheduled
(on the Internet)
Flexible Hybrid Electronics 2.0 (Subu Iyer) -- FHE, medical, wellness, scaling, advanced packaging technology trends ...
Scheduled
(on the Internet)
Flat-panel Display Systems with Mass-transferred MicroLEDs and MicroICs (Chris Bower) -- vivid, bright, fast, power-efficient, mass transfer technologies, transfer-printing ...
Scheduled
(on the Internet)
Heterogeneous Integration for Power Electronics -- (Pat McCluskey) conversion, distribution, wide-bandgap, reduced-size, power efficiency, thermal ...,
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(on the Internet)
Virtual Symposium on Reliability for Electronics and Photonics Packaging -- Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh) ...
from to
Scheduled
(on the Internet)
The Decade of Materials: Novel Materials for the Connected Digital World (Waguih Ishak) -- materials for electronic, RF, photonic applications for 5G, displays, life sciences ...
Scheduled
(on the Internet)
Ribbon Alumina Laminate for PCBs and Substrates (Tim Orsley) -- attributes, homogeneous, signal skew, loss tangent, stresses, drilling, process flow ...
Scheduled
(on the Internet)
Heterogeneous Integration for the Aerospace and Defense Sectors (Jeff Demmin) -- specific challenges, extreme performance, security, low volumes, roadmap ...
Scheduled
(on the Internet)
Design and Materials Challenges for Cost-effective High-performance LEDs (TY Hin) -- solid state lighting, design, materials, processes, challenges, innovative approaches ...
Scheduled
(on the Internet)
Packaging of Electronics for Medical, Health and Wearables Applications -- (Mark Poliks) heterogeneous integration, advance packaging, new materials, assembly technologies, forecasts ...
Scheduled
Design for Reliability and Accelerated Testing in Electronics and Photonics Packaging Engineering -- (Ephraim Suhir) improved reliability, critical applications, product lifetime, DfR, HALT ...
Scheduled
Integrated Photonics for Heterogeneous Integration -- (Bill Bottoms) design, analysis, current capabilities, challenges ...
Scheduled
On the Internet
Co-Design for Heterogeneous Integration -- (José Schutt-Ainé) electrical, thermal, mechanical, chip-package-board, design flow, new tools ...
Scheduled