… and Heterogeneous Integration Roadmap Annual Meeting: Electronics Resurgence and Renaissance in Science and Technology for Electronics Systems and Products
Symposium Date: Wednesday, 23 February 2022
Working Group Dates: Thursday-Friday, 24-25 February, 2022
| Download chapters from the Heterogeneous Integration Roadmap (no cost).
Videos from last year’s 2021 Symposium to view. Select On-Demand Videos Below: |
| Time (PST) | Title | Speaker |
| WEDNESDAY, 23 February 2022 | ||
| 7:30 AM | Welcome and Thanks to Speakers, Organizers and Sponsors Video:  (07:36) |
Heterogeneous Integration Roadmap Committee Members
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| 7:40 AM | Heterogeneous Integration: A Roadmap to the Next Era of Moore’s Law Video: (22:19) |
 Ajit Manocha, President and CEO, SEMI.4+ decade career in the semiconductor industry; CEO at GlobalFoundries; then Chairman of the Semiconductor Industry Association. He had the rare distinction of being inducted into two Hall of Fames: the Silicon Valley Engineering Council (in 2020), and the VLSI Research (in 2021) … (more) |
| 8:20 AM | Could We Work on The Demand Side Too … Please? Video: (23:05 + Q&A) |
 Willy Shih, Professor of Management Practice in Business Administration, Harvard Business SchoolHe is part of the Technology and Operations Management Unit, and he teaches in the MBA and Executive Education Programs. Willy’s expertise is in manufacturing, supply chains, and product development … (more) |
| 9:00 AM | A View of the Future of HPC Slides:  Video: (33:30 + Q&A) |
 David Mountain, Technical Director, US Dept. of DefenseDr. David J. Mountain is the Senior Technical Director of the Laboratory for Physical Sciences at Research Park, a Department of Defense research lab in Catonsville, MD. The LPS-RP mission is to collaborate with industry, academia, and the government to drive innovative research that will improve advanced computing systems for a range of mission applications … (more) |
| 9:50 AM | The Roaring 20s – A Renaissance for the Semiconductor Industry Slides: Video: (35:10 + Q&A) |
 Todd Younkin, President & CEO, Semiconductor Research Corporation (SRC)In August of 2020, Dr. Todd Younkin became the CEO of SRC, where he leads a ~US$90M/year global research agenda supported by ~3k academic and industrial researchers, 26 international companies, and 3 U.S. government agencies. Shortly thereafter, SRC released its 2030 Decadal Plan for Semiconductors, where it identified the five “seismic shifts” shaping the future of information and communication technologies (ICT) … (more) |
| 10:30 AM | Research Fab Germany (FMD): Bridging Chip Design to Applications Through Heterogenous Integration Slides: Video: (30:05 + Q&A) |
 Albert Heuberger, Fraunhofer Microelectronics Group Board ChairProf. Dr. Albert Heuberger is Executive Director of the Fraunhofer Institute for Integrated Circuits. Since 2011, he has held the Chair of Information Technologies with a focus on Communication Electronics at the University Erlangen-Nürnberg. His research interests … (more) |
| 11:10 AM | The T-Era Starts – Tera-Scale-Integration: Optimized Heterogeneous and Monolithic Integration Video: (49:28) |
 Nicky Lu, CEO & Founder, EtronDr. Nicky Lu is Managing Board Director, Taiwan Semiconductor Industry Association (TSIA). As a researcher, design architect, entrepreneur and chief executive, Dr. Lu has dedicated his career to the worldwide IC design and semiconductor industry. He also co-founded several other high-tech companies including Ardentec, Global Unichip and GTBF Corporations …. (more) |
| 11:45 AM | The Future is Heterogeneous Integration: The HIR 2021 Edition Video: (21:52) |
Heterogeneous Integration Roadmap Committee Members 
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| 12:20 PM | Wrap-up: Thanks to the plenary speakers + Day 2 & 3 TWG Workshop agenda review |  William Chen, Chair of the HI Roadmap Team William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President … (more) |
NIST Workshop
| 4:30 – 6:30 PM (EST) | WEDNESDAY, 23 February 2022 | ||
| NIST RFI Roundtable – CHIPS Act Advanced Packaging Manufacturing Program Chat comments: Video: (1:48:57)
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This Roundtable is a great introduction for understanding the US$52 billion that will be invested by the U.S. government to enhance domestic capabilities in semiconductor and advanced packaging manufacturing. You will see the particular questions that NIST is asking potential universities and companies that are interested in participating, to have their capabilities funded in the areas of workforce training (including university undergraduate and graduate education), pilot line development/expansion, and on-shore production. View the NIST RFI (and enter your own comments) at this location: RFI Solicitation. | |
Technical Working Group Meetings
| Time (PST) | Title/Event | Speaker/Details |
| THURSDAY, 24 February 2022 (PST) | ||
| 7:30 AM | HIR Cross-TWG Working Session Opening Briefing
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| 7:40 AM | HIR Session Group 1 Video: (1:15:04) |
 Moderator: Bill Bottoms, 3MTS. Working Groups: High Performance Computing & Data Centers, 2D-3D Interconnects, Thermal Management, Integrated Photonics, Test, and Co-Design. Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D. in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member … (more) |
| 9:10 AM | Invited Panel Session: Package Architecture and Co-Design Video: (1:23:13) |
 This panel addresses the challenges facing the adoption of a universal co-design strategy, with issues from both academic and EDA industry perspectives. AI and advanced computing are generating new breakthroughs. We assess these potentials and the role of the EDA community.Panelists: Ming Zhang, Synopsys; Madhavan Swaminathan, GaTech; Thomas Brandtner, Infineon; Nan Wang, Cisco; and Brett Wilkerson, AMD. Moderator: Prof. José Schutt-Ainé, UI-UC, and chair of the Co-Design TWG. José E. Schutt-Ainé is a Professor of Electrical and Computer Engineering Department at the University of Illinois. His current research interests include the study of signal integrity and the generation of computer-aided design tools … (more) |
| 10:40 AM | HIR Session Group 2 Video: (1:13:23) |
Moderator:  Ravi Mahajan, Intel. Working Groups: 5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; WLP (Fan-in & Fan Out); Materials & Emerging Research Materials; and Cyber SecurityRavi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes … (more) |
| 12:10 PM | Invited Keynote: Integrated Photonics, Heterogeneous Integration, and AIM Photonics Prototyping Video: (30:01)
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 Electronic-photonic co-packaging represents a significant challenge and cost-burden for photonic system designers. While photonic integrated circuits (PICs) are highly accessible … Dr. David Harame, COO, AIMS Photonics. David Harame is the Director of EPDA, Test and Packaging, and Process Development for the Research Foundation SUNY Polytechnic Institute and the Chief Operating Officer for AIM Photonics. David is responsible for the organization’s Photonic technologies, Electronic Photonic Design Automation process design kits, and Test, Assembly and Packaging (TAP) operations … (more) |
| 12:40 PM | Cross TWG Workshop Wrap Up | |
| FRIDAY, 25 February 2022 | ||
| 7:30 AM | HIR Cross-TWG Working Session Opening Briefing
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| 7:40 AM | HIR Session Group 3 Video: (1:06:02) |
 Moderator: Tom Salmon, SEMI. Working Groups: Automotive; SiP and Module; MEMS and Sensors Integration; Single Chip and Multi Chip Integration; Integrated Power Electronics; and Supply Chain
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| 9:00 AM | 3D Heterogeneous Integration (HI): An Enabler for Next Generation Systems Video: (36:22) |
 Thomas Kazior, PhD, IEEE Fellow, program manager in the Microsystems Technology Office, DARPA overview of the evolution of heterogenous integration programs at DARPA and potential paths forward. Dr. Thomas E. Kazior‘s research interests include semiconductor device design, fabrication and integration processes including wide-bandgap (WBG) and ultra-wide bandgap (UWBG) materials and devices for microwave/millimeter-wave/sub-millimeter-wave applications, device level heterogeneous integration, and 3D heterogeneous integration …. (more) |
| 9:40 AM | Invited Panel Session: Heterogeneous Integration: SiP and Module for Automotive Applications Video: (1:03:36) |
 Moderator: Rich Rice, ASERich Rice currently serves as Senior Vice President of Marketing and Technology Promotion at ASE, with responsibilities within the North America region. Since joining ASE in 2003, Rich has also held positions overseeing Business Development, West Region and North American sales and applications engineering support. Rich has gained over 37 years of experience … (more) |
| 11:00 AM | HIR Session Group 4 Video: (1:05:52) |
 Moderator: Amr Helmy, Univ of Toronto. Working Groups: Medical, Health and Wearables; IoT; Simulation; Reliability; Emerging Research Devices
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| 12:15 PM | Cross TWG Workshop Wrap Up
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