2-Hour Tutorial
Speaker: John H Lau, Unimicron Technology Corporation
Slides: January 5, 2023     On-demand video: (1:48:56)
Meeting Date: Thursday, January 5, 2023
Summary: Recent advances and trends in lead-free solder joint reliability are presented, with emphasis placed on the design for reliability (DFR) and reliability testing and data analysis. For DFR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and Sn3.8Ag0.7Cu0.03Ce; (b) the Wises two power creep constitutive equations and examples for Sn3.5Ag and Sn4Ag0.5Cu, (c) the Garofalo hyperbolic sine creep constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.9Ag0.6Cu, Sn3.8Ag0.7Cu, Sn3.5Ag0.5Cu, and Sn3.5Ag0.75Cu, Sn4Ag0.5Cu, Sn(3.5- 3.9)Ag(0.5-0.8)Cu, 100In, Sn52In, Sn3.8Ag0.7Cu0.03Ce, and Au20Sn; and (d) the Anand viscoplasticity constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.8Ag0.7Cu, Sn3.8Ag0.7CuCe, Sn3.8Ag0.7CuAl, Au20Sn, Sn3.5Ag with temperature and strain rate-dependent parameters, and Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu after extreme aging will be discussed. For reliability testing and data analysis: (a) the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests; (b) the true Weibull slope, true characteristic life, and true mean life; and (c) the linear acceleration factors for various lead-free solder alloys based on: (i) frequency and maximum temperature, (ii) dwell time and maximum temperature, and (iii) frequency and mean temperature will be presented. Some recommendations will also be provided.
Outline:
(A) INTRODUCTION: Solder Joints in Electronic Assemblies
(B) RELIABILITY TESTING AND DATA ANALYSIS
  (B.1) DEFINITION OF RELIABILITY
  (B.2) OBJECTIVE OF RELIABILITY TEST
  (B.3) OBJECTIVE OF QUALIFICATION TEST
  (B.4) TEST METHODS
  (B.5) STATISTICAL ANALYSIS OF RELIABILITY DATA – WEIBULL
  (B.6) STATISTICAL ANALYSIS OF RELIABILITY DATA – LOGNORMAL
  (B.7) A NOTE ON FAILURE CRITERIA
  (B.8) WHY ACCELERATION MODELS?
  (B.9) ACCELERATION FACTORS
(C) DESIGN FOR RELIABILITY
  (C.1) CONSTITUTIVE EQUATIONS FOR SOLDER ALLOYS
  (C.2) NORTON POWER CREEP
  (C.3) WISES TWO-POWER CREEP
  (C.4) GAROFALO HYPERBOLIC SINE CREEP
  (C.5) ANAND VISCOPLASTICITY
  (C.6) THERMAL-FATIGUE LIFE PREDICTION
(D) SUMMARY AND RECOMMENDATIONS

Who Should Attend? If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this tutorial. It is equally suited for R&D professionals and scientists. The lectures are based on publications by many distinguish authors and on books (by the lecturer) such as Reliability of RoHS Compliant 2D & 3D IC Interconnects (McGraw-Hill, 2011) and Assembly and Reliability of Lead-Free Solder Joints (Springer, 2020).

Bio: John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, has published more than 515 peer-reviewed papers (375 are the principal investigator), 40 issued and pending US patents (25 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., , Through-Silicon Via (TSV) for 3D Integration (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration (Springer, 2019), Semiconductor Advanced Packaging (Springer, 2021), and Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.