Speaker: Dr. Navid Asadi, University of Florida
Meeting Date: November 13, 2025
Time: Checkin via WebEx at 11:50 AM; Presentation at 12:00 noon (PST)
Cost: none
Reservations: events.vtools.ieee.org/m/498529
Summary:
The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible and scalable analysis. To address these challenges, our work advances an AI-powered multimodal inspection framework that couples physics-informed machine learning with structured data infrastructure. A Physics-Informed Neural Network (PINN) approach enhances SAM imaging by embedding acoustic wave physics into reconstructions, producing higher-fidelity images validated through structural similarity and physical accuracy metrics. Complementing this, multimodal data fusion across SAM, X-ray laminography, optical microscopy, and CT establishes richer defect detection and cross-validation. Central to this effort is the creation of multimodality benchmark datasets built on standardized acquisition protocols, structured metadata schemas, and annotation pipelines. These datasets provide not only a foundation for AI model training but also enable reproducibility, traceability, and interoperability across future programs.
Bio: Dr. Navid Asadi Dr. Navid Asadi is an Associate Professor in the Electrical and Computer Engineering Department at the University of Florida, with affiliations in the Materials Science and Engineering Department and the Radiology Department. He holds a Ph.D. in Mechanical Engineering and has dedicated his career to advancing research in physical inspection, assurance, non-destructive imaging, multi-modal image analysis, metrology, system- and chip-level decomposition, and counterfeit detection. Dr. Asadi serves as the director of the Security and Assurance (SCAN) Lab, which houses over $12 million in advanced imaging and characterization equipment. He is also the deputy director for research and development within the Florida Semiconductor Institute (FSI). His contributions have been recognized through numerous prestigious awards, including the NSF CAREER Award (2022), multiple best paper awards from IEEE HOST and ASME ISFA, and the D.E. Crow Innovation Award. Dr. Asadi is the founder and general chair of the IEEE Physical Assurance and Inspection of Electronics (PAINE) Conference. He holds over 20 patents, has authored three books, and has published more than 250 peer-reviewed articles in top-tier conferences and journals. His research projects are funded by various government agencies and industry leaders, including NSF, NIST, AFRL, AFOSR, ONR, the Army, SRC, Meta, Cisco, and Analog Devices.
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