The Santa Clara Valley EPS chapter is comprised of volunteers dedicated to the dissemination of electronic packaging technology, both in the Bay Area as well as globally. Our charter is to generate interest to benefit the community through education, networking, professional development by participation in seminars and webinars in the exciting and rapidly advancing field of electronic packaging technology. [Clockwise from front: Wendham Beyene, Gnyan Ramakrishnan, Ravi Agarwal, Bernie Siegal, Annette Teng, Gail and Paul Wesling, Tiwei Wei, Chandan Bhat, Azmat Malik, Ed Stoneham, Sandy Chew]
Program Director
Luu Nguyen, at PsiQuantum, received his PhD in mechanical engineering from MIT. He was with IBM Research (… more)
Director of Awards
Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates Inc. (TEA), and a Strategic Advisor to Indium Corporation and other innovative companies in the global semiconductor and electronics industry. (… more)
We welcome new volunteers to help us fulfill our mission to support technologists in Silicon Valley and the Greater San Francisco Bay Area. Please contact anyone above to get started.
Recognition and Awards: (open)
Membership Development: (open)
We have a number of DLs here in Silicon Valley. Here is a listing of current ones.
Mudasir Ahmad, Cisco Systems, Inc.
Topics: Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence
Wendem Beyene, Ph.D., Intel Corporation
Topics: Electrical modeling and simulation techniques for analysis of interconnects, packages, and systems. Machine learning techniques
Bill Bottoms, Ph.D., Third Millennium Test Solutions
Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing
William T. Chen, Ph.D., ASE (U.S.) INC
Topics: Semiconductor and Electronics Industry Trends and Roadmap
Madhu Iyengar, Ph.D., Google
Topics: Thermal component and system design for packages, servers, and data centers.
Ephraim Suhir, Ph.D.
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations
Paul Wesling
Topics: Origins of Silicon Valley and the EPS; Overview of the Heterogeneous Integration Roadmap
For a complete listing of EPS DLs, please visit the EPS Distinguished Lecturer Website.
2020-21: Annette Teng, Promex
2019: Gamal Refai-Ahmed, Xilinx
2017-2018: Annette Teng, Promex
2015-2016: Luu Nguyen, TI
2012-14: Ed Aoki, Agilent (retired)
2011: Mudasir Ahmad, Cisco
2009-10: Ed Aoki, Agilent (retired)
2007-2008: Dan Donahoe, Exponent
2005-2006: Allen Earman, Novalux
2002-2004: Tom Tarter, Neophotonics, Inc.
2000-2002: Bernie Siegal, Thermal Engineering Associates, Inc.
1998-2000: Martin Goetz, IBM Corp.
1996-98: Rufino Olay, Xilinx
1994-96: David Llewelyn, LTX
1992-94: Jim Lamb, LTX
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Home | Contact IEEE Santa Clara Vally Chapter, EPS | Accessibility | Privacy & Opting Out of Cookies | Nondiscrimination Policy
IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.