Silicon Valley Area Chapter


Our Mission

EPS Chapter Officers The Santa Clara Valley EPS chapter is comprised of volunteers dedicated to the dissemination of electronic packaging technology, both in the Bay Area as well as globally.  Our charter is to generate interest to benefit the community through education, networking, professional development by participation in seminars and webinars in the exciting and rapidly advancing field of electronic packaging technology. [Clockwise from front: Wendham Beyene, Gnyan Ramakrishnan, Ravi Agarwal, Bernie Siegal, Annette Teng, Gail and Paul Wesling, Tiwei Wei, Chandan Bhat, Azmat Malik, Ed Stoneham, Sandy Chew]

Chapter Officers and Volunteers

Chandan Bhat

Chandan Bhat

Chapter Chair

Chandan worked as an LED packaging engineer at the R&D center of Cree, Inc, Santa Barbara till 2017. He is currently with Xilinx, Inc., San Jose, CA as a Staff Thermal Packaging Engineer. (… more)

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Ninad Shahane


Ninad Shahane is currently a semiconductor packaging engineer with Texas Instruments Inc. He has a PhD in Materials Science from Georgia Institute of Technology (more)

Hualiang Shi


Hualiang Shi has ~20 years hands-on experiences on the development of semiconductor assembly/fab material/process/tools. Currently he is Principal Engineer at Meta Reality Lab (… more)

Azmat Malik

Azmat Malik


Azmat’s areas of interest are: Power Electronics, Energy Efficiency, Medical Devices, Sensors and MEMS. He teaches (… more)
Annette Teng

Annette Teng


Annette (SM: 2001) is the Chief Technology Officer at Promex Industries, a manufacturer of electronic and medical components in Silicon Valley, since 2014. She has spent most of her career in (… more)

Sandy Chew

Sandy Chew

Administrative Chair

Sandy Chew is Western Regional Sales Manager at VJ Electronix. Sandy has experience in marketing, sales, design engineering, and networking. She has a BS in Mechanical Engineering (… more)

Paul Wesling

Paul Wesling

Chapter Advisor; Webmaster; Publicity

Paul received degrees in electrical engineering and materials science from Stanford University, then worked locally at a number of Silicon Valley startups (… more)

Luu Nguyen

Luu Nguyen

Program Director

Luu Nguyen, at PsiQuantum, received his PhD in mechanical engineering from MIT. He was with IBM Research (… more)

Ravi Agarwal

Ravi Agarwal

Program Committee

Ravi is a technical sourcing manager at Facebook’s Infrastructure group, responsible for driving advanced packaging for both networking and AI/ML applications to meet Facebook’s future workloads. (more)

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Jonathan Lin

Assistant Webmaster

(to be added)

Dongkai Shangguan

Dongkai Shangguan

Director of Awards

Dr. Dongkai Shangguan, IEEE Fellow & IMAPS Fellow, is President of Thermal Engineering Associates Inc. (TEA), and a Strategic Advisor to Indium Corporation and other innovative companies in the global semiconductor and electronics industry. (… more)

Wendem Beyene

Wendham Beyene

Steering Committee

Wendem Beyene has been employed by IBM, Hewlett-Packard, Agilent Technologies, Rambus, and Intel. As a principal Engineer with Intel, he managed a team working on modeling and analysis (… more)

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Jin Yang

Program Committee

Jin Yang is a thermal architect with Intel Corporation located in Oregon USA. His research areas include, electronic and photonics packaging, and advanced package, component and system thermal management and microelectronics.

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Senior/Fellow Advancement

This small team of 3 to 5 Senior Members and IEEE Fellows has a focus on assisting regular members apply for advancement to Senior Member.  It also watches for Senior Members who might be nominated and endorsed to become IEEE Fellows.

We welcome new volunteers to help us fulfill our mission to support technologists in Silicon Valley and the Greater San Francisco Bay Area. Please contact anyone above to get started.

Recognition and Awards: (open)

Membership Development: (open)

Executive Committee

Dongkai Shangguan
Phil Marcoux

Our Local EPS Distinguished Lecturers

We have a number of DLs here in Silicon Valley. Here is a listing of current ones.

Mudasir Ahmad, Cisco Systems, Inc.
Topics: Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence

Wendem Beyene, Ph.D., Intel Corporation
Topics: Electrical modeling and simulation techniques for analysis of interconnects, packages, and systems. Machine learning techniques

Bill Bottoms, Ph.D., Third Millennium Test Solutions
Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing

William T. Chen, Ph.D., ASE (U.S.) INC
Topics: Semiconductor and Electronics Industry Trends and Roadmap

Madhu Iyengar, Ph.D., Google
Topics: Thermal component and system design for packages, servers, and data centers.

Ephraim Suhir, Ph.D.
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations

Paul Wesling
Topics:  Origins of Silicon Valley and the EPS; Overview of the Heterogeneous Integration Roadmap

For a complete listing of EPS DLs, please visit the EPS Distinguished Lecturer Website.

Past Chapter Chairs:

2020-21: Annette Teng, Promex
2019: Gamal Refai-Ahmed, Xilinx
2017-2018: Annette Teng, Promex
2015-2016: Luu Nguyen, TI
2012-14: Ed Aoki, Agilent (retired)
2011: Mudasir Ahmad, Cisco
2009-10: Ed Aoki, Agilent (retired)
2007-2008: Dan Donahoe, Exponent
2005-2006: Allen Earman, Novalux
2002-2004: Tom Tarter, Neophotonics, Inc.
2000-2002: Bernie Siegal, Thermal Engineering Associates, Inc.
1998-2000: Martin Goetz, IBM Corp.
1996-98: Rufino Olay, Xilinx
1994-96: David Llewelyn, LTX
1992-94: Jim Lamb, LTX