Silicon Valley Area Chapter

(SCV, SF, OEB)

Additive Manufacturing: Packaging Applications and Growth Needs for Heterogeneous Integration Impact 🗓

(Erickson) -- current practices, materials, capabilities, HI applications, challenges ...

Speaker: Kris Erickson, Materials Research Manager, Reality Labs Research

Download PDFSlides: February 1, 2024     On-demand video: View Webinar (41:28 plus Q&A)
Meeting Date: Thursday, February 1, 2024
Summary: This talk will cover major developments within additive manufacturing as applied towards electronics packaging needs generally and especially for heterogeneous integration applications, as well as overview the benefits and growth needs for these manufacturing approaches to have impact within our future electronic devices.

Bio: Kris Erickson is a Materials Research Manager at Reality Labs Research, based in Redmond, Washington, where he leads a team developing materials for the next generation of Mixed Reality devices. Kris received his PhD in Chemistry at UC-Berkeley, was a post-doctoral appointee at Sandia National Labs’ Materials Physics group, and was a Research Scientist and Manager at HP Labs where he researched and lead teams developing novel solutions in the spaces of Polymer 3D Print, Metal 3D Print, and 3D Printed Electronics.

Scheduled meetings slides Video webcast webinars
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