February 25, 2011

Speaker: Joachim N. Burghartz

Title: “Ultra-thin Chips – a New Paradigm in Silicon Technology”

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Abstract: In contrast to conventional thick silicon chips ultra- thin chips will be the basis for new applications, such as 3D integrated circuits (3D-ICs) and systems-in-foil (SiF). This talk will introduce and compare two generically different process technologies that can be exploited for the fabrication of ICs on extremely thin chips. Furthermore, several application results and demonstrations will be presented and discussed based on material that has been presented at IEDM and ISSCC conferences in recent years.

 

Brief bio: Joachim N. Burghartz is an IEEE Fellow, an IEEE Distinguished Lecturer, and an ExCom member of the IEEE Electron Devices Society. He received his MS degree from RWTH Aachen in 1982 and his PhD degree in 1987 from the University of Stuttgart, both in Germany. From 1987 thru 1998 he was with the IBM T. J. Watson Research Center in Yorktown Heights, New York, where he was engaged in early development of SiGe HBT technology and later in research on integrated passive components, particularly inductors, for application to monolithic RF circuits. From 1998 until 2005 he was with TU Delft in the Netherlands as a full professor and from 2001 as the Scientific Director of the Delft research institute DIMES. In fall 2005 he moved to Stuttgart, Germany, to head the Institute for Microelectronics Stuttgart (IMS CHIPS). In addition he is affiliated with the University of Stuttgart as a full professor. Dr. Burghartz has published about 300 reviewed articles and holds more than 30 patents.

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