Held locally, in Milpitas!
Conference Dates: October 19-22, 2025
Information, and to register: hwww.epeps.org
Summary: This conference from the Electronics Packaging Society is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. It is held locally this year, in Milpitas.