Held locally, in Milpitas!
Conference Dates: October 19-22, 2025
3-page Papers Solicited: By May 5, 2025
Call for Papers: hwww.epeps.org/papers.html
Summary: This conference from the Electronics Packaging Society is the premier international conference on advanced and emerging issues in electrical modeling, measurement, analysis, synthesis, and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and CAD/design techniques for evaluating signal, power, and thermal integrity and ensuring performance in high‐speed, RF, and wireless designs. It is held locally this year, in Milpitas; 3-page paper submissions are accepted for consideration through early May.