Conference Dates: June 16-18, 2025     Fort Collins, Colorado

Summary: Optical interconnects and advanced packaging technologies are rapidly transforming the landscape of high-performance computing (HPC) and data communication. With applications spanning HPC, data centers, telecommunications, sensing, and aerospace, these technologies have drawn significant interest from both academia and industry. The development of next-generation optical interconnects requires a multidisciplinary approach, integrating innovations in materials, photonic device engineering, packaging solutions, and system-level design. As the demand for higher bandwidth, lower power consumption, and scalable architectures continues to grow, collaboration across disciplines becomes essential to unlock the full potential of optical interconnects and packaging solutions.
The IEEE Optical Interconnects and Packaging (OIP) Conference —- formerly known as Optical Interconnects (OI) Conference —- is a single track, collaborative event dedicated to solving the future of high-density optical interconnects and packaging including evolving applications in
— High speed 200G/400G SerDes
— Energy efficient high density scale up/out interconnects
— Optical packaging and 3D-IC integration
— Next generation optical devices enabling high speed/low power

More information: oip-conference.org
Registration begins April 1st.