Silicon Valley Area Chapter


IEEE 71st Electronic Components and Technology Conference (ECTC) 🗓

-- Abstract deadline Nov 1: the best in packaging, components and microelectronic systems science, technology and education ...

The IEEE Electronics Packaging Society’s premiere technology conference.
Dates: June 1-4, 2021
Location: Virtual, via WebEx
ECTC is the premier international conference covering a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Includes short courses, 40 sessions, co-located with ITherm. Download the Advance Program.
Abstract Submission Deadline is November 1, 2020; for more information,

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