IEEE.org   |   IEEE Xplore Digital Library   |   IEEE Standards   |   IEEE Spectrum   |  More Sites

Silicon Valley Area Chapter

(SCV, SF, OEB)

IEEE 71st Electronic Components and Technology Conference (ECTC) 🗓

-- Abstract deadline Nov 1: the best in packaging, components and microelectronic systems science, technology and education ...

The IEEE Electronics Packaging Society’s premiere technology conference.
register
Dates: June 1-4, 2021
Location: Virtual, via WebEx
ECTC is the premier international conference covering a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Includes short courses, 40 sessions, co-located with ITherm. Download the Advance Program.
Abstract Submission Deadline is November 1, 2020; for more information, www.ectc.net

Scheduled conferences

Home  |  Contact IEEE Santa Clara Valley Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS, Serving Silicon Valley and the SF Bay Area. © Copyright 2022 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions
.A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.2

Home  |  Contact IEEE Santa Clara Vally Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.