Silicon Valley Area Chapter


Virtual Symposium on Reliability for Electronics and Photonics Packaging 🗓

-- Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPh) ...

REPP Symposium
SCV Electronics Packaging Chapter (with Reliability and Photonics)
Keynote Speakers: Subramanian S. Iyer, UCLA; Norman Chang, Ansys; Ravi Mahajan, Intel; Vipul Patel, Cisco; and others
Dates: Thursday & Friday, November 12-13, 2020

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Summary: This virtual symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

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