Dates: June 1-4, 2021
Location: Sheraton San Diego Hotel & Marina, San Diego, CA USA
ECTC is the premier international conference covering a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Includes short courses, 40 sessions, co-located with ITherm.
You can submit abstracts for consideration for presentation next June, in San Diego. Abstracts are due by October 4, 2020.
Full information here: www.ectc.net