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Silicon Valley Area Chapter

(SCV, SF, OEB)

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 🗓

-- Call for Abstracts: characterization, thermal management, liquid cooling, modeling, novel materials, CALL FOR PAPERS now open ...

Call for Abstracts (deadline: September 28, 2020)

Location: San Diego, CA USA
Dates: June 1-4, 2021
Abstracts Due: October 12, 2020 (Draft paper due December 21)
The IEEE ITherm Conference is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. Please consider submitting an abstract. Visit our website: ieee-itherm.net

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Home  |  Contact IEEE Santa Clara Vally Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.