The IEEE Electronics Packaging Society’s premiere thermal design/modeling conference.
Dates: July 21 – Aug 18, 2020 (originally May 26-29, 2020)
Location: The Cosmopolitan Hotel, Las Vegas, NV
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems. In addition to paper presentations and vendor exhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. Co-located with ECTC. Download the Advance Program.
Full information here: www.ieee-itherm.net
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