7 events found.
Week of Events
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CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
Electronics Packaging Chapter Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects -- 2-Hour Short Course: lead-free solder joints, power creep, viscoplasticity, temperature, strain rate, constitutive equations, thermal-cycling, examples, recommendations ... Speaker: John H Lau, Unimicron Technology Corporation Date: Thursday, January 5, 2023 Time: Checkin via WebEx at 7:45 AM; Presentation 8:00 – 10:00... Read more
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CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
Electronics Packaging Chapter Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects -- 2-Hour Short Course: lead-free solder joints, power creep, viscoplasticity, temperature, strain rate, constitutive equations, thermal-cycling, examples, recommendations ... Speaker: John H Lau, Unimicron Technology Corporation Date: Thursday, January 5, 2023 Time: Checkin via WebEx at 7:45 AM; Presentation 8:00 – 10:00... Read more