CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
Virtual: https://events.vtools.ieee.org/m/336882Electronics Packaging Chapter Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects -- 2-Hour Short Course: lead-free solder joints, power creep, viscoplasticity, temperature, strain rate, constitutive equations, thermal-cycling, examples,... Read more