CO-hosting event: Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects

Electronics Packaging Chapter Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects — 2-Hour Short Course: lead-free solder joints, power creep, viscoplasticity, temperature, strain rate, constitutive equations, thermal-cycling, examples, recommendations … Speaker: John H Lau, Unimicron Technology Corporation Date: Thursday, January 5, 2023 Time: Checkin via WebEx at 7:45 AM; Presentation 8:00 – 10:00 AM (PST) Cost: none vTools Information: https://events.vtools.ieee.org/m/336536 Registration: https://r6.ieee.org/scv-eps/?p=2996 Summary: Recent advances and trends in lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis, including: Norton power creep constitutive equations and examples; the Wises two power creep constitutive equations and examples; the Garofalo hyperbolic sine creep constitutive equations and examples; and the Anand viscoplasticity constitutive equations and examples, with temperature and strain rate-dependent parameters. For reliability testing and data analysis, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests; the true Weibull slope, true characteristic life, and true mean life; and the linear acceleration factors for various lead-free solder alloys based on frequency and maximum temperature, dwell time and maximum temperature; and frequency and mean temperature will be presented. Some recommendations will also be provided. Co-sponsored by: Habib Hichri Virtual: https://events.vtools.ieee.org/m/336882