CO-hosting event: Thermal and Failure Analysis of Advanced Sub-Micron Devices

Electronics Packaging Chapter Thermal and Failure Analysis of Advanced Sub-Micron Devices — thermal imaging, fine-geometry, static/dynamic, high-resolution, thermoreflectance, near-ultraviolet to infrared, examples … Speaker: Dr. Mo Shakouri, Microsanj Corp. Date: Thursday, January 26, 2023 Location: in person at SEMI World Hdqtrs, Milpitas, CA USA (and via WebEx) Time: Checkin at SEMI (sandwiches and drinks) at 11:30 AM; Presentation at noon (PST). WebEx at noon. Cost: none vTools Information: https://events.vtools.ieee.org/m/336546 Registration: https://r6.ieee.org/scv-eps/?p=2998 Summary: Performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking geometries, more complex 3-dimensional structures, and new materials. High temperatures, hot spots and temperature spikes can have a major impact on reliability. It is essential that one have a thorough understanding of static and dynamic thermal performance under operating and static conditions. This has traditionally been complex, time consuming, and often lacked the resolution required to detect thermal anomalies that could lead to early device failures. Fortunately, advances in thermal imaging techniques that combine the benefits of thermoreflectance-based analysis with illumination wavelengths from near-ultraviolet to near infrared coupled with infrared thermography can support thermal, spatial, and transient resolution consistent with today’s advanced complex device structures and shrinking geometries. In addition, equipment has advanced to considerably reduce the time and cost to get accurate results. Many examples will be shared to fully illustrate the device thermal behaviors that can be detected with these advanced thermal analysis techniques. Co-sponsored by: Habib Hichri Virtual: https://events.vtools.ieee.org/m/336898