Speaker: Luu Nguyen, TI Fellow, Texas Instruments
Meeting Date: Thursday, October 26, 2017 (changed from Sept. 13th)
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1710cpmt.eventbrite.com
Summary: For high-reliability applications in harsh environments, better understanding of the acceleration factors under the stresses of operation is required. Prolonged exposure of copper wires at elevated temperatures can result in excessive intermetallic growth and degradation of the bond interface. Mold compounds used for encapsulation can vary widely in their formulations including ionic content, pH, porosity, and diffusion rates. Selection of the right material combination plays a key role in defining the lifetime of the wirebonded system. This talk will discuss the combined effect of various operational parameters such as temperature and bias, along with material properties, in the development of a model to predict the remaining useful life of Cu-wirebonded packages.
Bio: Dr. Luu Nguyen is a TI Fellow at Texas Instruments, working on printed electronics, wafer level packaging, high-voltage packaging, and design for manufacturability. He received his Ph.D. in Mechanical Engineering from MIT, and has worked at IBM Research and Philips Research. He coedited two books on packaging, and has over 200 publications. He has over 70 patents and invention disclosures. He is a Fellow of IEEE and ASME, and a Fulbright Scholar (Finland 2002). He received two Best of Conference Awards, one Best Poster of Conference Award, and eight IMAPS and IEMT Best of Session Conference Awards. He received the 2004 IEEE CPMT Outstanding Sustained Technical Contributions Award. Other awards also include the 2003, 2014, 2015, and 2016 Mahboob Khan Outstanding Mentor Award from the Semiconductor Research Corporation in recognition of contributions to student mentoring, research collaboration, and technology transfer.
