Speakers: Jennifer Sammakia and Stephen Cain, Binghamton University
Meeting Date: Thursday, April 24, 2025
Time: Checkin via WebEx at 11:50 AM; Presentation at 12:00 noon (PDT)
Cost: none
Reservations: events.vtools.ieee.org/m/479386
Summary: The Analytical & Diagnostics Laboratory (ADL), an initiative under Binghamton University’s S3IP Center of Excellence, is a centralized, interdisciplinary research facility. Partnering with the Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology, the ADL advances electronics packaging, reliability, and manufacturing research. Together, they drive innovation in systems integration, flexible electronics, renewable energy, and medical devices.
Many industry partners collaborate with us for our advanced instrumentation, stress testing capability, and failure analysis expertise. In this talk, we will review several case studies that center around these topics in microelectronics. For example, in modern high-powered applications, electromigration which has been predominately a chip level phenomenon is now a concern for circuit boards with BGA sized features. We will show the progression from test vehicle design through evaluation into failure characterization. Another example centers around identification of an open circuit in a functional printed circuit board. We will further elaborate on techniques used to isolate failures and identify failure mechanisms as well as the relationship between these mechanisms and typical environmental stresses.
Bio: Jennifer Sammakia received her doctorate in chemistry at University of Wales Bangor, U.K. Her work as a research scientist at Syracuse and Binghamton Universities in Upstate New York has concentrated on developing nanomaterials for energy harvesting. Jennifer joined the Analytical and Diagnostics Laboratory in 2018 as a research scientist and became Director in 2022.
Bio: Stephen Cain received his doctorate in chemistry at Cornell University. He joined the IEEC at Binghamton University after nearly 25 years with the IBM Corporation, where he held a variety of engineering positions in the development, quality and reliability organizations. He has vast experience with the failure mechanisms associated with a variety of printed circuit configurations, spanning the large thick boards used in mainframe computers to the small films used as laminate chip carriers.
