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Silicon Valley Area Chapter

(SCV, SF, OEB)

Electronic Components and Technology Conference (ECTC) 🗓 🗺

-- the best in packaging, components and microelectronic systems science, technology and education ...

The IEEE Electronics Packaging Society’s premiere technology conference.
register
Dates: May 30 – June 2, 2023
Location: In-Person, Orlando Florida USA
ECTC is the premier international conference covering a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Includes 14 short courses, 40 sessions. Download the Advance Program.
Interested in heterogeneous integration? Arrive on Monday for the free, all-day HI Workshop on Tuesday! Co-registration available for ITherm (co-located).
For more information, www.ectc.net

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Home  |  Contact IEEE Santa Clara Vally Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.