(Links to Slides, Below)
Speakers: Professors and Researchers at Georgia Tech/NSF Packaging Research Center (see below)
Sponsored by: CPMT Chapter, with Vehicular Technology Chapter, Technology and Engineering Management Chapter, Photonics Chapter
Workshop Date: Friday, March 24, 2017
Time: 12:30 PM Registration and Networking; 1:00 – 5:30 PM Workshop; 5:45 Reception
Cost: $35 IEEE members. students, unemployed, $50 non-members ($15 more at door)
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: 1703cpmt.eventbrite.com
For information about exhibiting your technology at this Workshop, please contact Paul Wesling at 408-320-1105.
Summary: This new era of automotive electronics — such as autonomous driving, in-car smartphone-like infotainment, privacy and security, high-speed and high-bandwidth computing, and all-electric cars — requires an entirely differnt vision than is pursued today. There are unprecedented challenges and opportunities to adress these needs with a systematic approach to system scaling, innovative device and package architectures, and heterogeneous integration for the new era, with particular focus on electrical, mechanical, and thermal designs, and new digital, RF, millimeter wave, LiDAR, camera, high-power and high-temperature electronics technologies.
The challenges in this new era are many, and include not only new technologies, but also an educated workforce, supply chain manufacturing, roadmaps, and standards. This workshop will describe the needs and challenges, as well as review the state-of-the-art in R&D and in manufacturing.
Program and Schedule:
| Time | Details |
| 12:30 | Registration/Sign-In and Networking |
| 1:00 | The New Era of Automotive Electronics: The Ultimate Electronics System Presentation Slides: “The New Era of Automotive Electronics: Intro to GaTech PRC Industry Consortium” (5.2 MB PDF)  Prof. Rao Tummala, Director, NSF Packaging Research Centerinfotainment, autonomy, innovative architectures, system scaling, design challenges, roadmaps, manufacturing … [more] |
| Session 1 | Computing and Communications Electronics |
| 1:45 | 2.5D Glass Interposer For Ultra-high Bandwidth Computing Presentation Slides: “Glass Packaging R&D” (3.2 MB PDF)  Dr Venky Sundaram and Prof Rao Tummala, Georgia Tech— 2.5D and 3D integration, large panel processing, low cost interposers, through-glass vias, reliability, compliant interconnections, data centers … [more] |
| 2:15 | Low- and Medium-Power Electronics Presentation Slides: “Power Packaging for Computer Applications” (2 MB PDF)  Dr. Raj Pulugurtha and Prof Rao Tummala, Georgia Tech— IVR, DC-DC converters, substrate-embedded inductors, transformers and capacitors, high-temp and high-voltage capacitors … [more] |
| 2:45 | Coffee, Tea Break; Networking and Exhibitor Interactions |
| 3:15 | 5G Communications with Glass Embedding and Fanout Presentation Slides: “5G (28-40 GHz) Substrates and Antennas” (.5 MB PDF) and “5G Communications with Glass Embedding and Fanout” (6 MB PDF)  Prof. Emmanouil Tentzeris, Dr. Venky Sunraram and Dr. Raj Pulugurtha, Georgia Tech— Advanced 5G substrates, package-integrated antennas, low-loss and precision 5G transmission lines, passive components … [more] |
| Session 2 | Sensing Electronics |
| 3:45 | Devices and 3D Glass Fanout Package for Next Generation Radar, Lidar and Camera Presentation Slides: “Autonomous Cars: Radar, Lidar, Stereo Cameras” (4 MB PDF)   Dr. Venky Sundaram, Dr. Chris Valenta, Prof. Peter Hesketh and Prof. John Cressler, Georgia Tech— sensor fusion, SiGe devices, low-cost LiDAR packaging, hermetic and near-hermetic glass packages for sensors, design for reliability … [more] |
| Session 3 | Devices, Packaging and High-Temperature Materials for Power Electronics in Electric Cars |
| 4:15 | High-Power and High-Temperature Electronics for Electric Cars Presentation Slides: “High-Power Devices, High-Temperature Materials and Packaging for Electric Cars” (5 MB PDF)   Prof. Shyh-Chiang Shen, Dr. Vanessa Smet and Dr. Raj Pulugurtha, Georgia Tech— Packaging for 150-250 C, high-temp dielectrics and mold compounds, high-temp substrates and fan-out packages … [more] |
| 5:00 Experts Panel |
 Moderator: Paul Wesling— Questions, observations, future directions |
| 5:45 Reception |
Refreshments and Networking — snacks and drinks — Meet our exhibitors — Consult with the speakers |
| 6:30 | Dismissal |
