Speaker: Henning Schröder, Optical Interconnection Technologies Group, Fraunhofer IZM, Berlin, Germany

Meeting Date: Thursday, August 11, 2022
Time: Checkin via WebEx at 7:50 AM; Presentation at 8:00 AM (PDT)
Cost: none
Reservations: eps2208a.eventbrite.com
Summary: Experience from chip-level integration, known from electronics and “classical” integrated photonics, may provide guidelines and solutions for quantum devices in communication and sensing. However, monolithic photonic platforms do not meet the stringent demands of most quantum applications. Integration of active opto-electronic components, such as light sources, photodiodes and modulators, can complete the spectrum of required building blocks. We have developed integration technologies and packaging solutions for quantum systems built on years of experience with glass-based electro-optic circuit boards (EOCBs) developed for data communication, with the structuring and stacking of thin glasses for micro-photonic assembling. Experience gathered with glass-based EOCBs is being extended at Fraunhofer IZM into the quantum domain by extending the single-mode optical guidance into the visible and NIR spectral range through innovative light-matter coupling interfaces, and by further development of hermetic glass joints for packaging of hybrid quantum systems.

Bio: Dr. Henning Schröder received his M.Sc. degree in applied physics from the University of Magdeburg, Germany and his Ph.D. degree at the Technical University of Berlin in 2000. Currently he is with Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, heading the Optical Interconnection Technologies Group. His main fields are R&D of photonic packaging and optical interconnection technologies for printed circuit boards and photonic modules. His research focus lies on the design, fabrication and performance enhancement of optical glass waveguides and micro optics for PCB and optical sensors, their characterization, and on reliable micro-optical assembling and packaging technologies for photonic modules including optical fiber attachment. He holds patents in photonic packaging technologies. Henning is a member of the German Physical Society, the German Society of Applied Optics, and the European Optical Society. He is author and co-author of more than 140 books and papers, and he is member of various scientific committees within IEEE and SPIE.