Speaker: Dr. Ning-Cheng Lee, VP Technology, Indium Corporation
Meeting Date: Tuesday, November 20, 2018
Time: 8:00 AM (PT)
Cost: none (open only to EPS members)
Location: on the Internet
Reservations: eps.ieee.org/education/eps-webinars.html
Summary: This Webinar covers the detailed materials considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMCs) under a variety of material combinations, aging conditions, and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in detail, and novel alloys with high reliability will be presented. The emphasis of this talk is placed on the understanding of how various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability.
Bio: Ning-Cheng Lee is the Vice President of Technology for Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries. In addition, he has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.
Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” from Newnes, and co-author of “Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials” from McGraw-Hill. He is also the author of book chapters for several lead-free soldering books. He received the 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2008 and 2014 awards from IPC for Honorable Mention Paper-USA Award from the APEX conference, and the 2010 Best Paper Award of SMTA China South Conference. He was honored as 2002 Member of Distinction from SMTA, 2003 Lead Free Co-Operation Award from Soldertec, 2006 Exceptional Technical Achievement Award from IEEE-EPS, 2007 Distinguished Lecturer for EPS, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 IEEE Senior Member, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow. He has served on the board of governors for EPS and SMTA board of directors. Among other editorial responsibilities, he serves on the editorial advisory board for Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology. He has numerous publications and frequently gives presentations, invited talks at seminars, keynote speeches and short courses worldwide on those subjects at international conferences and symposiums.
