Speakers: (name, affiliation)

Symposium Dates: Thurs-Fri, (January 22-23, 2026
Cost: $115 (IEEE Members: $95); Virtual participation: $60
Information and Reservations: attend.ieee.org/hbs
Summary: Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.

Review the Advance Program; on-site registration may be limited due to venue capacity.