IEEE.org   |   IEEE Xplore Digital Library   |   IEEE Standards   |   IEEE Spectrum   |  More Sites

Silicon Valley Area Chapter

(SCV, SF, OEB)

IEEE/EPS Hybrid Bonding Symposium 🗓

-- Enabling Hybrid Bonding Commercialization: performance, technology, materials, equipment, reliability ...

SCV Electronics Packaging Chapter
register
Meeting Dates: January 16-17, 2025
Location: Both in-person (at SEMI Hdqtrs, Milpitas CA USA) and online (via WebEx)
HBS Registration includes access to On-Demand videos of most presentations (2 weeks after Symposium)
Information and Registration: attend.ieee.org/hbs
Summary: Hybrid Bonding is the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come.

from to
Scheduled conferences meetings
at SEMI World Hdqtrs (and on the Internet) Map

Home  |  Contact IEEE Santa Clara Valley Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS, Serving Silicon Valley and the SF Bay Area. © Copyright 2022 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions
.A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.2

Home  |  Contact IEEE Santa Clara Vally Chapter, EPS  |  Accessibility  |  Privacy & Opting Out of Cookies  |  Nondiscrimination Policy

IEEE Santa Clara Valley Chapter, EPS
Serving Silicon Valley and the SF Bay Area
© Copyright 2020 IEEE – All rights reserved. Use of this Web site signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.