IEEE Reliability and Electronics Packaging Societies

Meeting Dates: November 12-14, 2024
Location: Marriott at the Space & Rocket Center, Huntsville, AL USA
Information and Reservations: www.paine-conference.org
Summary: Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for chip designers, original equipment manufacturers, and system developers. The complex long life of electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training, and services. The number of programs introduced by the US government has increased over the years to analyze and develop relevant solutions. Although much focus is given to the digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.
The IEEE PAINE conference provides a unique venue for all researchers and practitioners from academia, industry, and government to have productive dialog on such topics.