Organized by the Malaysia EPS Chapter
Speaker: Prof. Kuan Yew Cheong, School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia
Meeting Date: Wednesday, June 26, 2024
Time: Checkin via WebEx – Presentation at 7:00 PM (PDT)
Cost: none
Reservations: ieeemeetings.webex.com/
Summary: Failure is unavoidable in high volume manufactured engineering products, which includes advanced packages for numerous applications to address the competitive needs in the era of digitization and electrification. In order to minimize failure and to improve quality, robustness, durability, reliability, and safety of a product, investigation of failure is an important and yet complex and complicated activity that requires integration of diverse knowledge in science and engineering by inter-relating fundamental and technological knowledge of engineering materials, processes, and operation principles of the product. As more diverse, complex, and conflict engineering materials with complicated geometry and distinctive difference in dimension, interactions of engineering materials within an advanced package are getting complicated. Hence, a systematic, effective, and data-driven approach must be adopted in failure analysis. In this lecture, basic strategy and essential knowledge required to create postulation, verification, and confirmation of failures, subsequently to establish failure mechanisms, and finally to identify root causes of failures in advanced packaging will be elaborated. Fundamental understanding of critical property, performance, and characterization will be correlated to failures in advanced packaging. Potential challenges in failure analysis will be briefly presented at the end of the lecture.
Bio: Kuan Yew Cheong is a Professor of Materials & Mineral Resources Engineering at the Universiti Sains Malaysia. He received his PhD from Griffith University, Australia in 2004. Currently, he is working on designing, processing, characterizing of engineering materials for wafer (Si- and wide bandgap-based semiconductors) and package level, including physical failure analysis of these applications. He has published more than 250 high impact-factor journals, 6 reputable book chapters, 5 edited books, 1 granted Malaysian Patent, and delivered close to 300 technical training courses, for the past 14 years, related to failure analysis techniques/strategies and engineering materials for wafer and advanced packaging. Prof. Cheong is also actively involved in IEEE EPS activities, serving as a Vice President of IEEE EPS Malaysia Section and Executive Committee for more than 10 years, organizing committees of IEEE EPS/IEEE flagship conferences, such as IEMT, and delivered tutorials and keynotes in conferences organized by IEEE. Currently, he is Editor-in-Chief of “Materials Science in Semiconductor Processing” (Elsevier), Fellow of The Institution of Engineers Malaysia (IEM), Senior Member of IEEE, Principal Interviewer for Professional Interview of IEM, Senior Evaluation Panel of Engineering Program Accreditation under Engineering Accreditation Council, Malaysia, Founding Chairman of Material Engineering Technical Division under IEM, and technical consultant of failure analysis for MIMOS Semiconductor Sdn Bhd (Malaysia).
