Organized by the IEEE-EPS Binghamton Chapter
Speaker: Dr. Ivy Qin, Kulicke and Soffa
NOTE: This presentation has been postponed until spring 2023; more information will be distributed later

Meeting Date: not yet set (was Wednesday, December 7, 2022)
Cost: none
Registration to receive future notification: eps2212a.eventbrite.com
Summary: With the latest technology developments, an autonomous wire bonder is no longer a distant dream. In this presentation, we will cover the key technology advances that will enable autonomous wire bonders, how we will get there, and the current status. The presentation focuses on two successful approaches that have achieved a high level of optimization and automation, which are the step stones to autonomy. First is the Smart Response Based Process that is capable of self-optimization with closed-loop control capability. A good example is the development of a learning algorithm to understand the overhang-die property and determine the optimal bonding parameters for a memory stack die application. Second is an effective approach is Fault Detection and Classification (FDC) with a self-recovery function. FDC is achieved using real time bonder signals and post-inspection data. FDC, followed by automatic error recovery, dramatically improves wire bonder up-time and self-recovery, which move us another step closer to the lights-out factory and an autonomous bonder. This presentation will share real production data showing the dramatic improvement in productivity and factory efficiency with these recent technology advances. This presentation will also discuss the key future technologies that are needed to make a wire bonder truly autonomous.

Bio: Ivy Qin, is a Senior Director of Engineering at Kulicke and Soffa Industries, Inc. She received her MS and Ph.D. degrees from University of Pennsylvania in Mechanical Engineering and Applied Mechanics. She leads the engineering team for the ball-bonder business unit with responsibilities for new equipment and technology development. She serves on the semiconductor HIR (Heterogeneous Integration Roadmap) committee, responsible for the wire bonding industry roadmap. She has received 15 US patents, 48 worldwide patents, published over 50 technical articles, and co-authored two books.