Silicon Valley Area Chapter

(SCV, SF, OEB)

Developing Hi-Rel Interconnect Technology for Deep Space Applications 🗓

(Choudhury) -- extremes, environmental/mechanical, robust technology, reliability lifetime, NASA, JWST ...

Organized by the Silicon Valley ASQ Chapter
Speaker: Ratan K. (RK) Choudhury
Meeting Date: Wednesday, July 20, 2022
Time: Checkin via Zoom at 6:45 PM; Presentation at 7:00 PM (PDT)
Cost: none
Meeting ZOOM link: us06web.zoom.us/j/81630839321?pwd=aWNneHRTTlhrWHJqOUVGYnA0cndlZz09
Summary: Deep space applications are subjected to extremes in environmental/mechanical conditions and thus require robust interconnect technologies not only for L1 interconnect but also L2 interconnects. Thus, they require innovative and robust technology that can stand these extremes to guarantee the mission lifetimes and provide long-term reliability lifetimes for applications. This study was a joint study with NASA to find the suitable interconnect technology in the early phases for the sensor electronics in the James Webb Space Telescope (JWST) that has been designed and deployed to provide more insight into the origins of the Universe nearly going back to few hundred million years after the Big Bang.
Bio: Ratan K. Choudhury (“R.K”) has worked in the semiconductor industry for over 30 years in various leadership roles including process development, integration, design, product engineering and Q&R in the Bay Area. During his career, he has worked collaboratively with NASA and JPL on high-reliability space applications and has developed and managed HiRel IC and packaging technologies. Most recently, he led the quality teams in the US and Japan for NASAM to provide space products to JAXA for satellites and rockets. He holds an MS degree in Materials Engineering from Rensselaer Polytechnic Institute, Troy, New York and a BS degree in Materials Engineering from the Indian Institute of Technology, Kanpur, and continued studies in Electrical Engineering and Device Physics from Santa Clara University and UC Berkeley Extension.

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