Speaker: Jie Xue, Vice President Technology & Quality, Cisco Systems, Inc.
On-demand video: 
(48:56 plus Q&A)
Meeting Date: Friday, May 6, 2022
Summary: Advanced Packaging technologies including Silicon and Silicon photonics are key enablers for scaling the Hyperscale Data Center. This talk will discuss the roadmap of technology building blocks with a focus on increasing performance while reducing power per Gbps. Challenges for device integration, reliability and industry eco-system collaboration will also be discussed.
Jie Xue
Bio: Jie Xue leads Cisco’s Technology and Quality organization, a global team responsible for pathfinding, developing, and executing technology innovations to enable all Cisco networking product portolio. Jie oversees development of leading edge technologies for Si-Photonics, Advanced Si, ASICs, PCBs, Optics, memory, and complex interconnect technologies. Prior to joining Cisco, Jie held several management and engineering positions at Motorola, Inc., working on R&D and product development.
Jie is an IEEE Fellow, and served as President of the IEEE’s Electronics Packaging Society (EPS) 2014-2015. She has published more than 90 technical papers and holds 15 patents. Jie holds a Bachelor of Science from Tsinghua University in Beijing, China and a Master of Science and PhD from Cornell University.
