Co-sponsored with the San Diego EPS Chapter
Speaker: Dr. Ephraim Suhir, Portland State University

Meeting Date: Thursday, April 22, 2021
Time: 5:00 PM (PDT)
Cost: none
Reservations: events.vtools.ieee.org/m/267150
Summary: The following three practically important questions associated with predicting and improving the reliability of solder joint interconnections (SJI) of IC packages are addressed in this lecture:
I. Could inelastic strains in the solder material be avoided by a rational design, and if not, could the sizes of the inelastic strain areas be predicted and, if possible, minimized?
II. Considering that the difference between a highly reliable and an insufficiently reliable product is “merely” in the level of its never-zero probability of failure, and that SJIs are usually the most vulnerable structural elements in an IC package design, could this probability be assessed at the design stage and, if possible, made adequate for the given application?
III. Should temperature cycling accelerated testing for SJIs be replaced with a more physically meaningful, less costly, less time- and labor-consuming and, most importantly, less misleading accelerated test vehicle?

Bio: Ephraim Suhir is on the faculty of Portland State University. He is also CEO of the Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA).