Silicon Valley Area Chapter


Holistic Understanding of Thermo-Mechanical Challenges from Package to System to Maximize Silicon Performance 🗓

(Gamal Ahmed) -- mechanical integrity, thermal, packaging, materials behavior, costs ...

Speaker: Gamal Refai-Ahmed, PhD, Xilinx
Meeting Date: Thursday, March 4, 2021
Time: Checkin via WebEx at 11:50 AM; Presentation at 12:00 noon (PST)
Cost: none
Summary: This presentation addresses the impact of the assembly and manufacturing technology and direction on the advancing packaging Mechanical integrity and its thermal characterizations. In this talk, you will see clearly the full picture to answer the question of will Lidded or Lidless Advanced Packaging have better Thermo-Mechanical Characteristics? The answer of this question need to have a full understanding of the manufacture and assembly, materials behavior, the cost, the mechanical stresses, the end user application and the target thermal performance. It is not surprising to find that a wrong decision can impact the package performance and lose more than 30% to 50% of the desired performance.

Bio: Gamal Refai-Ahmed, PhD, LFASME, FCAE, FEIC, FIEEE, Xilinx Fellow and Chief Thermo-Mech Architect.

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