Dates: Thursday and Friday, 25-26 February 2021
Time: 7:30 AM – 12:30 PM PST
Cost: none
Location: On the Internet (via Zoom)
Reservations: eps2102wkshp.eventbrite.com
The IEEE’s Heterogeneous Integration Roadmap is 600+ pages of details across all areas of advanced packaging, covering pre-competitive information for industry, working engineers, and academia. It is intended to guide product development over the next decade, with projections out through 2034. You do not need a separate registration for the one-day HIR Symposium (February 24) — you will receive links for both the Symposium and the Working Group meetings.
All TWG members (and invited prospective members) are welcome to register for the Working Group sessions, which include cross-TWG panels/discussions and invited speakers, and participate in these discussions. Results desired as a result of these cross-TWG discussions:
1) informational exchange between the assembled Chapter participants to identify additions/changes that should be made for 2021; and:
2) Recording of the specific cross-Chapter harmonization that should be considered for the major 2021 rewrite of the Roadmap.
For your own TWG, here are questions you may want to ask:
— Are there common challenges you would like to discuss with other TWGs and coordinate efforts to tackle?
— Is there information that you would like other TWGs to address?
— Is there inconsistency between information you have in your chapter and those reported by the other TWGs?
— Are there other topics you wish to discuss with these TWGs?
Thursday, February 25: (Print Out; Download Applicable Chapters)
(all times USA-Pacific time – PST)
07:30 am – 07:40 am: HIR Cross-TWG Panel Session Opening – IRC
07:40 am – 09:10 am: HIR Panel Session 1 (6 panelists each speak 8 minutes, 42 min Cross-TWG Q&A)
Included TWGs:
— High Performance Computing & Data Centers (Download Chapter 2)
— 2D-3D & Interconnect (Download Chapter 22)
— Thermal Management (Download Chapter 20)
— Integrated Photonics (Download Chapter 9)
— Test Technologies (Download Chapter 17)
— Cyber Security (Download Chapter 19)
09:10 am – 09:15 am: Break
09:15 am – 10:45 am: HIR Panel Session 2 (5 panelists each speak 8 minutes, rest of time 40 min Cross-TWG Q&A)
— Automotive (Download Chapter 5)
— MEMS & Sensors Integration (Download Chapter 11)
— SiP & Module (Download Chapter 21)
— Supply Chain (Download Chapter 18)
— Integrated Power Packaging (Download Chapter 10)
10:45 am – 10:50 am: Break
10:50 am – 12:10 pm: HIR Chiplet Workshop: “Architectures for Heterogeneous Integration”, Raja Swaminathan, Senior Fellow, AMD; “Business Aspects of Heterogeneous Integration”, Bapi Vinnakota, Open Compute Project Foundation
12:10 pm – 12:30 pm: Day Wrap Up
Friday, February 26:
(all times USA-Pacific time – PST)
07:30 am – 07:40 am: HIR Cross-TWG Panel Session organization briefing – IRC
07:40 am – 08:20 am: Keynote Speaker John Oakley, a Science Director at SRC, focused on leading Hardware Security, Packaging, Automotive Electronics, and Intelligent Cognitive Assistant research.
08:20 am – 09:50 am: HIR Panel Session 3 (6 panelists each speak 8 minutes, 42 min Cross-TWG Q&A)
— 5G, RF and Analog Mixed Signal (Download Chapter 12)
— Mobile (Download Chapter 7)
— Aerospace & Defense (Download Chapter 6)
— Wafer-Level Packaging (WLP) (Download Chapter 23)
— Materials & Emerging Research Materials (Download Chapter 15)
— Internet of Things (IoT) (Download Chapter 3)
09:50 am – 09:55 am : Break
09:55 am – 11:15 am : HIR Panel Session 4 (5 panelists each speak 8 minutes, 40 min Cross-TWG Q&A)
— Medical, Health & Wearables (Download Chapter 4)
— Emerging Research Devices (Download Chapter 16)
— Single Chip and Multi Chip Integration (Download Chapter 8)
— Co-Design (Download Chapter 13)
— Modeling and Simulation (Download Chapter 14)
11:15 am – 11:20 am : Break
11:20 am – 11:40 am: Cross- TWG Best Practices Town Hall
11:40 am – 12::00 pm: Planning for 2021 events
12:00 pm – 12:30 pm : Cross TWG Workshop Wrap Up
