— SiP solution, enabling technologies, applications, packaging, market segments …
Speaker: Dr. Wendem T. Beyene, Rambus Inc.
Meeting Date: Tuesday, May 10, 2016
Presentation Slides: “Package Requirements for High-Speed Systems” (3 MB PDF) after meeting
Time: 11:30 AM Registration (and sandwiches/drinks); 12:00 PM Presentation
Presentation-only: 12:00 noon (come at 11:45)
Cost: $5 IEEE members. students, unemployed, $10 non-members

Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara
Reservations: (URL)
Summary: As data rates increase rapidly in high speed systems — such as in SerDes and memory systems — to meet the bandwidth growth required by various applications, the electrical performance of packages has become critical. In addition, the role of new emerging 2.5D and 3D IC packaging platforms with ever-increasing system integration requirements have made the role of packaging even more important. The sources of signal loss, noise coupling and discontinuities in packages must be fully understood and minimized when designing packages. At the same time, the design and development of packages have to meet cost, performance, form factor and reliability goals. In this talk we will examine the key electrical characteristics: signal loss, signal crosstalk, return loss, mode conversion, power integrity and other important factors affecting the bandwidth of high-speed systems. These key performance metrics are discussed using measurement results from various package designs.

Bio: Wendem T. Beyene received his B.S. and M.S. degrees in Electrical Engineering from Columbia University, in 1988 and 1991 respectively, and his Ph.D. degree in Electrical and Computer Engineering from University of Illinois at Urbana-Champaign, in 1997. In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. He is currently a technical director at Rambus Inc. where he is responsible for signal and power integrity of multi-gigabit serial and parallel interfaces.