Three sponsoring chapters: Electronics Packaging; Electron Devices; and Photonics
Speakers: Dr. Bill Chen, ASE; and Dr. Bill Bottoms, 3MTS

Webinar Date: Wednesday, May 6, 2019
Time: 8:00 AM – 9:00 AM PDT
Cost: none
Location: on the Internet
Reservations: ieee.webex.com (to get URL location)
Summary: The Heterogeneous Integration Roadmap (HIR) provides a long term vision for the electronics industry, identifying difficult future challenges and potential solutions. The roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic technology requirements for the electronics industry evolution for the next 15 years, and a 25-year vision for the heterogeneous integration of emerging devices and emerging materials with longer research and development timelines. The purpose is to stimulate pre-competitive collaboration and thereby accelerate the pace of progress.
The HIR is designed to be a system application-driven roadmap, blending the duality of market pull and technology push across the entire electronics ecosystem. The 23 chapters, including the Executive Summary, includes market application drivers, building blocks of electronics systems, cross cutting technology areas, and integration technologies, and represents the interacting complexities of the electronics industry. This webinar will give an introduction of the Heterogeneous Integration Roadmap. We shall highlight a few of the examples from the chapters and give perspectives of how the roadmap may be used by the profession.
Over following weeks, webinars will cover each of the chapters within the Roadmap, presented by the chairs of their respective Working Groups. To get dates and topics, please join our Chapter Dlist (if you aren’t already on it).

Bio: William (Bill) Chen holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was the Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. He was a past President of the IEEE Electronics Packaging Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He received the IEEE Electronics Packaging Field Award for contribution to electronic packaging from research & development through industrialization. He chairs the Heterogeneous Integration Roadmap initiative.
Bio: Bill Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D. in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. Dr. Bottoms has participated in the startup and growth of many companies through his venture capital activity and through his own work as an entrepreneur.