Organized by the Indiana Electronics Packaging Society Chapter
Speaker: Dr. Mukta Farooq, Distinguished Research Scientist, IBM (and IEEE Fellow)

Meeting Date: Friday, November 1, 2024
Time: Checkin via Zoom for presentation at 9:00 AM (PDT)
Cost: none
Reservations: events.vtools.ieee.org/m/440607
Summary: While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronics packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures.

Bio: Dr. Mukta Farooq is an IBM Distinguished Research Scientist, and the 3D/Heterogeneous Integration Technology Leader at IBM Research. She is an IEEE Fellow, an IEEE EDS Distinguished Lecturer, and winner of the 2023 EDS JJ Ebers Award. Mukta is a Distinguished Alumna of IIT-Bombay (India). Mukta is a metallurgist and materials scientist with expertise in Heterogeneous Integration for Chiplet Technology, CMOS BEOL, Lead-free Alloys, and Chip-Package Interaction. She has 244 granted US patents, 66 granted international patents, and is an IBM Lifetime Master Inventor and IBM Academy of Technology member. She has been invited to give keynote talks and teach short courses, and to write papers in her field of expertise. Mukta received her BS from IIT-Bombay, MS from Northwestern University, and PhD from Rensselaer Polytechnic Institute.