Sponsor: IEEE Electronics Packaging Society, Silicon Valley

Meeting Date: Thursday-Friday, February 23-24, 2023
Time: 9:00 AM – 5:00 PM PST
Cost: $75 in-person; $40 for WebEx
Location: in person at SEMI World Hdqtrs, Milpitas, CA
Reservations: IEEE
Summary:
Summary: Eight Invited Plenary Presentations (NIST, DoD, IBM, Samsung, Intel, AMD, ITRI, Penn State) ● “HI Platform for Next Generation Computing (‘Beyond Moore’)”; ● “HI Development – Interdisciplinary Innovations” ● “AI for Chip Technology and Heterogeneous Integration” ● “High-Bandwidth Interconnect for an Open Chiplet Ecosystem” ● “The CHIPS Act-related National Advanced Packaging Manufacturing Program” ● “HI for the Next Decade – An Academic Perspective” (and more) PLUS White Paper talks on Additive Manufacturing for HI, and Packaging Challenges in Quantum Computing; Key updates from groupings of the HI Roadmap Working-Groups (with cross-Group panels); Feedback & Dialogue.