IEEE Santa Clara Valley Chapter
Jan 15, 2004
Our speaker was Dr.Tallis Blalack (Cadence), and the topic of his presentation was
“On chip RF Isolation Techniques”
On-chip isolation is a function of many interdependent variables. This talk will use industry examples to highlight isolation impacts of technology – substrate doping levels and triple wells, grounding schemes, guard rings, shielding, capacitive decoupling and package inductance. For more information, refer to IEEE BCTM publication.
Tallis Blalack has been working on substrate noise coupling issues for the past 10 years. His work started at Stanford University for his Ph.D. under Professor Bruce Wooley. It continued at Snaketech, where he set up the US office and helped direct the SubstrateStorm product. Snaketech was acquired by Simplex Solutions in March of 2000, and Simplex was then acquired by Cadence Design Systems in June of 2002. At Cadence Dr. Blalack serves as a technical marketing architect for extraction and substrate products.
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