Sponsor: Foothill Section Jt. Chapter, AP03/MTT17,CAS04/ED15
Speaker: Dr. Bodhisatwa Sadhu from IBM T.J. Watson Research Center & Columbia University
Meeting Date: September 18, 2021
5G cellular communications use millimeter-wave phased arrays to achieve high data rates and low latency. The majority of the 5G millimeter-wave infrastructure will be partially or completely based on silicon technology. This talk will discuss key aspects of silicon-based millimeter-wave phased-array module design and characterization. It will cover fundamentals of phased arrays, provide an overview of phased array antenna modules using silicon technology, and take a deep dive into an example 5G phased array antenna module. The talk will end with a peek into the future of 5G directional communications.
Bio: Bodhisatwa Sadhu received the B.E. degree in Electrical and Electronics Engineering from Birla Institute of Technology and Science – Pilani (BITS-Pilani) in 2007, and the Ph.D. degree in Electrical Engineering from the University of Minnesota, Minneapolis, in 2012. He is currently a Research Staff Member with the RF/mm-wave Communication Circuits & Systems Group at IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, and an Adjunct Assistant Professor at Columbia University, NY. At IBM, he has led the design and demonstration of the world’s first reported silicon-based 5G phased array IC, a low power 60GHz CMOS transceiver IC for 802.11ad communications, a software-defined phased array radio, and a self-healing 25GHz low noise frequency synthesizer. He has authored and co-authored 15+ journal papers, 30+ conference papers, the book Cognitive Radio Receiver Front-Ends-RF/Analog Circuit Techniques (Springer, 2014), and several book chapters. He holds 20 issued U.S. patents with 20+ pending. Dr. Sadhu currently serves as an IEEE MTT-S Distinguished Microwave Lecturer, the RFIC Systems Applications sub-committee chair of IEEE RFIC Symposium, TPC member of Wireless Subcommittee at IEEE ISSCC, and has served as a Guest Editor of IEEE JSSC in 2017.