IEEE SCV EMCS Chapter

This virtual meeting can accommodate up to 100 attendees. While military systems in general have to operate in tough electromagnetic environments, missile programs require special attention and considerations from an EMI/EMC perspective. From environments to requirements to best practices, this presentation will discuss key focuses of EMI/EMC engineering in relation to missile programs and systems and how best to achieve success. Speaker(s): Flynn Lawrence, Flynn Lawrence Virtual: https://events.vtools.ieee.org/m/508800

IEEE EMC Chapter is sponsoring the event but no monetary gain is gained or funded by the chapter. Location: Cadence Design Systems, Bldg 5, 2655 Seely Ave., San Jose, CA Registration link will bring you to the options of the Paid workshop but also to the Free Exhibit/TC events 2025 Silicon Valley Area Workshop on EMC Design of High-Speed Systems workshop with Free Exhibit and Free IEEE EMC Technical Committee 10 on Signal and Power Integrity meeting. For more details on the specific agenda including abstract and speakers' bio, go to https://drive.google.com/file/d/1oHHiBJtyebP1JgqafZF65pR9A0y145uA/view?usp=sharing Agenda: Agenda Table-top Vendor Exhibit in Lobby from 10:20 AM – 2:25 PM Vendors are still signing up and already include Rohde and Schwarz, PCB Automation, Nexperia, Cadence Design Systems, PacketMicro, and Clear Signal Solutions 8:30 AM Light breakfast and registration 9:00 AM Welcome remarks and introductions Electromagnetic Compatibility 9:10 AM EMC Applications of 3D Printable Materials Dr. Victor Khilkevich, Missouri Univ. of Sci. and Tech. 9:45 AM Model-based EMC Analysis and Diagnosis towards Design-for-EMC Dr. Dipanjan Gope, SimYog Technology and Indian Institute of Science 10:20 AM Break and vendor table-top show 10:45 AM Modeling ESD Protection for High-Speed Applications Dr. Daryl Beetner, Missouri Univ. of Sci. and Tech. 11:20 AM Round Table Discussion - Future directions and challenges in EMC 11:50 AM Lunch 12:50 PM Challenges and Opportunity for Data Center Generation and Distributions Dr. Zhiping Yang, PCB Automation 1:25 PM Machine Learning-Assisted Power Delivery Network Design Dr. Chulsoon Hwang, Missouri Univ. of Sci. and Tech. 2:00 PM Break and vendor table-top show 2:25 PM Challenges with next generation interconnect solutions Stephen Scearce, Amphenol 3:00 PM Round Table Discussion - Future directions and challenges in SIPI for High- Speed Systems 3:30 PM Happy Hour sponsored by Cadence Design Systems IEEE EMC Mini Seminar-Paper Series Sponsored by IEEE EMC Society Technical Committee 10 on Signal and Power Integrity Speakers and papers to be announced. Session will include re-presentation of some of the best SI/PI papers from recent conferences. 4:00 PM End of program Bldg: 5, 2655 Seely Ave., San Jose, California, United States, 95134

Road Safety has vastly increased due to continued development in Automotive Driver Assisted Systems (ADAS). A critical element of these systems are high resolution digital cameras. To facilitate high data transfer between camera and the ADAS ECU, serial/deserializer (“SerDes”) communication links are used, which primarily consist of coaxial cable interconnects. This paper will focus on the challenges in using SerDes in an automotive environment with special focus on required shielding performance. The talk will include review of current USCAR standards and needed future improvements. Speaker(s): Roger Frazier, Agenda: 5:30-6:15pm: Social, free food and drink 6:15pm: Chapter Admin, start of presentation Bldg: (at CKC company), 46025 Warm Springs Blvd, Fremont, California, United States, 94539