2024 IEEE EPS Phoenix Section Seminar: Materials and Reliability for Advanced Packaging and Heterogeneous Integration by Dr. Dongkai Shangguan
Room: Conference Room 3654, Bldg: Macro Technology Works Building, 7700 S River Pkwy, Tempe, Arizona, United States, 85284Abstract: As electronic products become more pervasive in applications, interconnect reliability must be considered holistically with regard to environmental conditions, from thermomechanical to electrical and electrochemical. Thermal dissipation is another […]