Title: Advanced Packaging Technology for AI and HPC Biography: David McCann is Sr VP in the Business Unit at Amkor Technology where he is responsible for Amkor’s US assembly/test factory, test business, and turnkey strategy.  Prior to this he worked in the Photonics industry for 4 years.   Previously, he was VP of Post Fab Operations and Development at Global Foundries for 8 years, responsible for internal bump and probe factories, packaging and test development and operations. Before joining Global Foundries, David led the Flip Chip Business Unit at Amkor Technology where he worked for 11 years. David was a member of the ECTC Executive Committee for 10 years, and is presently on the IEEE Electronics Packaging Society (EPS) Board of Governors where he serves as VP of Technology. David has presented keynotes and technical papers at ECTC, IMAPS, Confab, MEPTEC, and other conferences over the past 20 years and has patents in the areas of photonics, RF, and sensor packaging. David lives in Arizona. Location: Macro Technology Works Building Conference Room 3654 Agenda: Refreshments: 5:30-6:00pm Seminar Talk: 6:00-7:00pm MTW Tour: 7:00-7:30pm

Title: Materials and Reliability for Advanced Packaging and Heterogeneous Integration Abstract: As electronic products become more pervasive in applications, interconnect reliability must be considered holistically with regard to environmental conditions, from thermomechanical to electrical and electrochemical. Thermal dissipation is another great concern as the power density increases. Understanding the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package is of great importance to interconnect reliability and device performance. At the same time, as newer forms of interconnects emerge in advanced packaging to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects in the same package, with complex reliability failure modes and mechanisms. In this presentation, the technology trends for advanced packaging will be outlined, and the growing demand for new materials for high density interconnects will be discussed. Process robustness, reliability and product performance are some of the important considerations for innovative materials solutions for advanced packaging and heterogeneous integration. Thermal management solutions will also be discussed. Biography: Dr. Dongkai Shangguan, IEEE Fellow, is Strategic Advisor to Indium Corporation, and President of Thermal Engineering Associates, Inc. Previously, he served as Corporate Vice President at Flex (formerly Flextronics) for Technology & Engineering, and as Chief Marketing Officer at STATSChipPAC. Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon. Dr. Shangguan has published 3 books, including the recent book “Direct Copper Interconnection for Advanced Semiconductor Technology”. He has also authored/co-authored over 200 technical papers, and has been issued 33 U.S. patents. Dr. Shangguan has served on the iNEMI Board of Directors, the IEEE EPS Board of Governors, and the IPC Board of Directors. He is an IEEE EPS Distinguished Lecturer. He has previously received a number of recognitions for his contributions to the industry, including the Daniel C. Hughes, Jr. Memorial Award and the William D. Ashman Achievement Award from IMAPS, the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, the President’s Award from IPC, and the Total Excellence in Electronics Manufacturing Award from the Society of Manufacturing Engineers. Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San Jose State University, and Ph.D. in Materials from the University of Oxford, U.K. He conducted post-doctoral research at the University of Cambridge and The University of Alabama. Dongkai currently lives in San Jose, CA, and travels globally in service of the industry. Location: Macro Technology Works Building Conference Room 3654 Agenda: Refreshments: 5:30-6:00pm Seminar Talk: 6:00-7:00pm MTW Tour: 7:00-7:30pm