Title: Electronics Packaging for Implantable Microsystems Abstract: Implantable microsystems are revolutionizing healthcare by enabling continuous monitoring, targeted therapy, and closed-loop interventions inside the human body. At the core of this innovation, electronics packaging ensures safe, reliable, and effective access to life-saving therapies. Miniaturization remains a major challenge, driven by demands for longevity, power autonomy, and regulatory constraints on changing device form factors. Guided by Medtronic’s mission to contribute to human welfare by applying biomedical engineering to alleviate pain, restore health, and extend life, we continue to advance packaging technologies that enable devices such as cardiac monitoring devices, pacemakers and defibrillators, spinal cord and deep brain neurostimulators, and wearable sensors. This talk will highlight emerging trends shaping next-generation implantable systems and examine future challenges—from biocompatibility and reliability to regulatory hurdles—that must be overcome to fully realize their potential. Biography: Neha Patel is a Distinguished Engineer at Medtronic, where she leads innovation in implantable microsystems and advanced electronics packaging for medical devices. After spending a decade at Intel developing semiconductor packaging expertise, Neha transitioned to healthcare to apply that expertise toward improving patient outcomes. Driven by a passion for engineering solutions that make a meaningful difference, she continues to push boundaries in miniaturization and high-reliability design for next-generation medical implants. Location: Macro Technology Works (MTW) Building Conference Room 3654 (Google Maps) Date: January 29, 2026 Agenda: Refreshments: 5:30-6:00pm Seminar Talk: 6:00-7:00pm MTW Tour: 7:00-7:30pm