Title: Advanced Packaging Technology for AI and HPC

Biography: David McCann is Sr VP in the Business Unit at Amkor Technology where he is responsible for Amkor’s US assembly/test factory, test business, and turnkey strategy.  Prior to this he worked in the Photonics industry for 4 years.   Previously, he was VP of Post Fab Operations and Development at Global Foundries for 8 years, responsible for internal bump and probe factories, packaging and test development and operations.

Before joining Global Foundries, David led the Flip Chip Business Unit at Amkor Technology where he worked for 11 years.

David was a member of the ECTC Executive Committee for 10 years, and is presently on the IEEE Electronics Packaging Society (EPS) Board of Governors where he serves as VP of Technology.

David has presented keynotes and technical papers at ECTC, IMAPS, Confab, MEPTEC, and other conferences over the past 20 years and has patents in the areas of photonics, RF, and sensor packaging.

David lives in Arizona.

Location: Macro Technology Works Building Conference Room 3654

Agenda:
Refreshments: 5:30-6:00pm
Seminar Talk: 6:00-7:00pm
MTW Tour: 7:00-7:30pm