IEEE-USA’s Designing Chips with CHIPS: West Coast Pre-Silicon Summit is a one-day semi summit that will bring together leading thinkers from chip design and packaging companies, along with government policy makers, to discuss the chip design industry in light of the historic CHIPS Act. Held in-person at Qualcomm’s Irwin M Jacobs Hall on Qualcomm’s main campus in San Diego, California on 3 November 2023, this event will look at the CHIPS Act from the specific perspective of design firms and packaging companies, with a special focus on the west coast. Details: (https://chipdesign.ieeeusa.org/) Co-sponsored by: IEEE-USA Agenda: 8:00 AM Breakfast & Networking 8:30 AM Keynote – Industry perspectives 9:30 AM Breakout Sessions: Perspective from the Manufacturers 10:30 AM Morning Networking Break 11:00 AM Breakout Sessions: Perspective from Design and Packaging Firms 12:00 PM Lunch – Government Perspective 1:30 PM Breakout Sessions – Workforce Trends & Challenges 2:30 PM Afternoon Networking Break 3:00 PM Breakout Sessions – What’s Coming Next? 4:00 PM Wrap-up Bldg: Qualcomm Headquarters – Building N, 5775 Morehouse Drive, Irwin M Jacobs Qualcomm Hall, San Diego, California, United States, 92121